PNX1311EH/G,557 NXP Semiconductors, PNX1311EH/G,557 Datasheet - Page 192
PNX1311EH/G,557
Manufacturer Part Number
PNX1311EH/G,557
Description
IC MEDIA PROC 166MHZ 292-HBGA
Manufacturer
NXP Semiconductors
Datasheet
1.PNX1300EHG557.pdf
(549 pages)
Specifications of PNX1311EH/G,557
Applications
Multimedia
Core Processor
TriMedia
Controller Series
Nexperia
Ram Size
48K x 8
Interface
I²C, 2-Wire Serial
Number Of I /o
169
Voltage - Supply
2.375 V ~ 2.625 V
Operating Temperature
0°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
292-HBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Program Memory Type
-
Other names
568-1295
935277721557
PNX1311EH/G
935277721557
PNX1311EH/G
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PNX1300/01/02/11 Data Book
12.17.1.2 64-Mbit Devices
64-Mbit SDRAMS organized in x32 can be used to build
an 8-, 16-, 24-, or 32-MB memory system.
12-10
Figure 12-5. Schematic of a 8-MB memory system consisting of one 4 512K 32 SDRAM (one rank).
Figure 12-6. Schematic of a 16-MB memory system consisting of two ranks of 4 512K 32 SDRAM chips.
PRELIMINARY SPECIFICATION
MM_CLK[0]
MM_CS#[1]
MM_CLK[0]
MM_CS#[0]
MM_CLK[0]
MM_CS#[0]
Figure 12-5
CLK
Address[10:0]
Control
CS#
CLK
Control
CS#
Address[10:0]
BA[1:0]
BA[1:0]
BA[1:0]
CLK
Address[10:0]
Control
CS#
PNX1300
PNX1300
4 512K 32
4 512K 32
4 512K 32
SDRAM
SDRAM
SDRAM
DQM[3:0]
DQM[3:0]
DQ[31:0]
DQ[31:0]
shows an 8-MB memory system (one device only) and
Figure 12-6
order to build a 16-MB configuration.
DQM[3:0]
DQ[31:0]
MM_DQM[3:0]
MM_DQM[3:0]
MM_DQ[31:0]
MM_DQ[31:0]
details an extension of the block diagram in
Philips Semiconductors
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