PNX1311EH/G,557 NXP Semiconductors, PNX1311EH/G,557 Datasheet - Page 36

• Manufacturer Part Number: PNX1311EH/G,557
• Description: IC MEDIA PROC 166MHZ 292-HBGA
• Manufacturer: NXP Semiconductors

Specifications of PNX1311EH/G,557

• Applications: Multimedia
• Core Processor: TriMedia
• Controller Series: Nexperia
• Ram Size: 48K x 8
• Interface: I²C, 2-Wire Serial
• Number Of I /o: 169
• Voltage - Supply: 2.375 V ~ 2.625 V
• Operating Temperature: 0°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 292-HBGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Program Memory Type: -
• Other names: 568-1295; 935277721557; PNX1311EH/G

PNX1300/01/02/11 Data Book
1.7
1.8
To order 143-MHz/2.5V product, part number is ‘PNX1300’, 12 nc product code 9352 7097 6557.
To order 180-MHz/2.5V product, part number is ‘PNX1301’, 12 nc product code 9352 7097 9557.
To order 200-MHz/2.5V product, part number is ‘PNX1302’, 12 nc product code 9352 7098 2557.
To order 166-MHz/2.2V product, part number is ‘PNX1311’, 12 nc product code 9352 7098 5557.
1-10
HBGA292: plastic, heatsink ball grid array package; 292 balls; body 27 x 27 x 1.75 mm
DIMENSIONS (mm are the original dimensions)
UNIT
mm
PACKAGE
ORDERING INFORMATION
max.
2.51
A
ball A1
index area
0.70
0.50
A 1
W
k
U
R
N
G
C
A
L
E
J
M
K
H
D
B
Y
V
T
P
F
1.83
1.63
A 2
1
PRELIMINARY SPECIFICATION
2
k
3
0.90
0.60
4
b
e
5
6
27.2
26.8
7
D
8
9
10
24.1
23.9
D 1
e 1
D 1
D
11
12
b
13
27.2
26.8
14
E
0
15
16
w
24.1
23.9
17
E 1
M
18
19
20
1.27
e
scale
10
e
24.13
B
v
e 1
j
M
e 1
E 1
B
v
21.0
15.4
A
E
M
j
A
20 mm
4.2
3.8
k
A
A 2
A
0.2
y 1 C
v
1
0.2
w
0.15
Philips Semiconductors
y
detail X
C
X
0.25
y
y 1
SOT553-1