PNX1311EH/G,557 NXP Semiconductors, PNX1311EH/G,557 Datasheet - Page 199

• Manufacturer Part Number: PNX1311EH/G,557
• Description: IC MEDIA PROC 166MHZ 292-HBGA
• Manufacturer: NXP Semiconductors

Specifications of PNX1311EH/G,557

• Applications: Multimedia
• Core Processor: TriMedia
• Controller Series: Nexperia
• Ram Size: 48K x 8
• Interface: I²C, 2-Wire Serial
• Number Of I /o: 169
• Voltage - Supply: 2.375 V ~ 2.625 V
• Operating Temperature: 0°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 292-HBGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Program Memory Type: -
• Other names: 568-1295; 935277721557; PNX1311EH/G

Philips Semiconductors
12.17.2 Block Diagrams for a 16-bit interface
The following figures (i.e.
and
64-, 128- and 256-Mbit SDRAMs organized in x16. They
respectively build a memory system of 8-, 16- or 32-MB.
MM_CONFIG.SIZE must be set to 5 (i.e. 8-MB rank size,
Section
Figure 12-13. Schematic of a 8-MB memory system consisting of one 4 1M 16 SDRAM chips (one rank)
Figure 12-14. Schematic of a 16-MB memory system consisting of one 4 2M 16 SDRAM chips (one rank)
Figure
12.6.1) for all of the pictured configurations.
12-15) detail the SDRAM connections for the
Figure
MM_CLK[0]
MM_CLK[0]
12-13,
Figure 12-14
Address[11:0]
Address[11:0]
CLK
Control
CLK
Control
BA[1:0]
BA[1:0]
PNX1300
PNX1300
4 1M 16
4 2M 16
SDRAM
SDRAM
MM_CONFIG.BW must be set to ‘1’ (refer to bw,
Section
Note the connections described in
256-Mbit SDRAM device organized in x16 can also be
used to connect a 128-Mbit SDRAM device organized in
x16,
board for two different memory size configurations (i.e.
32 MB or 16 MB).
PRELIMINARY SPECIFICATION
DQM[1:0]
DQM[1:0]
DQ[15:0]
DQ[15:0]
CS#
CS#
Figure
12.6.1).
GND
GND
12-14, allowing the same footprint on the
MM_DQM[1:0]
MM_DQM[1:0]
MM_DQ[15:0]
MM_DQ[15:0]
SDRAM Memory System
Figure 12-15
for the
12-17