PNX1311EH/G,557 NXP Semiconductors, PNX1311EH/G,557 Datasheet - Page 197
PNX1311EH/G,557
Manufacturer Part Number
PNX1311EH/G,557
Description
IC MEDIA PROC 166MHZ 292-HBGA
Manufacturer
NXP Semiconductors
Datasheet
1.PNX1300EHG557.pdf
(549 pages)
Specifications of PNX1311EH/G,557
Applications
Multimedia
Core Processor
TriMedia
Controller Series
Nexperia
Ram Size
48K x 8
Interface
I²C, 2-Wire Serial
Number Of I /o
169
Voltage - Supply
2.375 V ~ 2.625 V
Operating Temperature
0°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
292-HBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Program Memory Type
-
Other names
568-1295
935277721557
PNX1311EH/G
935277721557
PNX1311EH/G
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Philips Semiconductors
128-Mbit SDRAMs organized in x32 can be used to build
16-, 32-, 48- or 64-MB memory systems. A 32-MB sys-
tem is pictured in
Figure 12-11. Schematic of a 32-MB memory system consisting of two ranks of 4 1M 32 SDRAM chips.
Figure
12-11. A 16-MB system can be
MM_CLK[0]
MM_CS#[1]
MM_CLK[1]
MM_CS#[0]
CLK
Address[11:0]
Control
CS#
CLK
Control
CS#
Address[11:0]
BA[1:0]
BA[1:0]
PNX1300
4 1M 32
SDRAM
4 1M 32
SDRAM
DQM[3:0]
DQM[3:0]
DQ[31:0]
DQ[31:0]
obtained by removing the device controlled
MM_CS#[1]. Similarly it can be extended to 48- or 64-MB
by adding devices controlled by MM_CS#[3:2].
PRELIMINARY SPECIFICATION
MM_DQM[3:0]
MM_DQM[3:0]
MM_DQ[31:0]
MM_DQ[31:0]
SDRAM Memory System
12-15
by
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