PNX1311EH/G,557 NXP Semiconductors, PNX1311EH/G,557 Datasheet - Page 194
![IC MEDIA PROC 166MHZ 292-HBGA](/photos/6/76/67651/pnx1311eh_g_sml.jpg)
PNX1311EH/G,557
Manufacturer Part Number
PNX1311EH/G,557
Description
IC MEDIA PROC 166MHZ 292-HBGA
Manufacturer
NXP Semiconductors
Datasheet
1.PNX1300EHG557.pdf
(549 pages)
Specifications of PNX1311EH/G,557
Applications
Multimedia
Core Processor
TriMedia
Controller Series
Nexperia
Ram Size
48K x 8
Interface
I²C, 2-Wire Serial
Number Of I /o
169
Voltage - Supply
2.375 V ~ 2.625 V
Operating Temperature
0°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
292-HBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Program Memory Type
-
Other names
568-1295
935277721557
PNX1311EH/G
935277721557
PNX1311EH/G
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PNX1300/01/02/11 Data Book
64-Mbit SDRAMs organized in x8 devices could be used
to build a 32-MB memory system as illustrated in
Figure
12-12
Figure 12-8. Schematic of a 32-MB memory system consisting of four 4 2M 8 SDRAM chips (one rank)
12-8. Note that due to the unusual way of using
PRELIMINARY SPECIFICATION
MM_CLK[1]
MM_CLK[1]
MM_CLK[0]
MM_CLK[0]
CLK
Control
CLK
Control
CLK
Control
CLK
Control
Address[11:0]
Address[11:0]
Address[11:0]
Address[11:0]
BA[1:0]
BA[1:0]
BA[1:0]
BA[1:0]
PNX1300
4 2M 8
SDRAM
4 2M 8
SDRAM
4 2M 8
SDRAM
4 2M 8
SDRAM
the devices, it is the only supported configuration with x8
devices. MM_CONFIG.SIZE must be set to 6 (i.e. 16-MB
rank size,
DQ[7:0]
DQ[7:0]
DQ[7:0]
DQ[7:0]
DQM]
DQM]
DQM]
DQM
CS#
CS#
CS#
CS#
Section
GND
GND
GND
GND
MM_DQ[23:16]
MM_DQ[31:24]
MM_DQ[15:8]
MM_DQM[3]
MM_DQM[2]
MM_DQ[7:0]
MM_DQM[1]
MM_DQM[0]
12.6.1).
Philips Semiconductors
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