PNX1311EH/G,557 NXP Semiconductors, PNX1311EH/G,557 Datasheet - Page 198

• Manufacturer Part Number: PNX1311EH/G,557
• Description: IC MEDIA PROC 166MHZ 292-HBGA
• Manufacturer: NXP Semiconductors

Specifications of PNX1311EH/G,557

• Applications: Multimedia
• Core Processor: TriMedia
• Controller Series: Nexperia
• Ram Size: 48K x 8
• Interface: I²C, 2-Wire Serial
• Number Of I /o: 169
• Voltage - Supply: 2.375 V ~ 2.625 V
• Operating Temperature: 0°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 292-HBGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Program Memory Type: -
• Other names: 568-1295; 935277721557; PNX1311EH/G

PNX1300/01/02/11 Data Book
12.17.1.4 256-Mbit Devices
256-Mbit SDRAMs organized in x16 can be used to build
a 64-MB memory systems.
Note the connections described in
256-Mbit SDRAMs organized in x16 can also be used to
connect the 128-Mbit SDRAM devices organized in x16
allowing the same footprint on the board for two different
12-16
Figure 12-12. Schematic of a 64-MB memory system consisting of two 4 4M 16 SDRAM chips (one rank)
PRELIMINARY SPECIFICATION
Figure 12-12
MM_CLK[0]
MM_CLK[1]
Figure 12-12
details a 64-MB
Address[12:0]
CLK
Control
CLK
Address[12:0]
Control
BA[1:0]
BA[1:0]
for the
PNX1300
4 4M 16
4 4M 16
SDRAM
SDRAM
memory system. MM_CONFIG.SIZE must be set to 7
(i.e. 32-MB rank size,
memory size configurations (i.e. 64 MB or 32 MB). Refer
to
case.
DQM[1:0]
DQM[1:0]
DQ[15:0]
DQ[15:0]
Figure 12-10
CS#
CS#
GND
GND
MM_DQ[31:16]
MM_DQM[3:2]
MM_DQ[15:0]
MM_DQM[1:0]
for detailed connection of the 32-MB
Section
Philips Semiconductors
12.6.1).