AT91CAP7E-NA-ZJ Atmel, AT91CAP7E-NA-ZJ Datasheet - Page 499

• Manufacturer Part Number: AT91CAP7E-NA-ZJ
• Description: MCU CAP7 FPGA 225LFBGA
• Manufacturer: Atmel
• Series: CAP™r

Specifications of AT91CAP7E-NA-ZJ

• Core Processor: ARM7
• Core Size: 16/32-Bit
• Speed: 80MHz
• Connectivity: EBI/EMI, FPGA, IrDA, SPI, UART/USART, USB
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 32
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: ROM
• Ram Size: 160K x 8
• Voltage - Supply (vcc/vdd): 1.08 V ~ 1.32 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 225-LFBGA
• Processor Series: AT91Mx
• Core: ARM7TDMI
• Data Bus Width: 32 bit
• 3rd Party Development Tools: JTRACE-ARM-2M, MDK-ARM, RL-ARM, ULINK2
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

34. AT91CAP7E Mechanical Characteristics
34.1
34.1.1
Table 34-1.
34.1.2
8549A–CAP–10/08
Symbol
θ
θ
JA
JC
Thermal Considerations
Thermal Data
Junction Temperature
Parameter
Junction-to-ambient thermal resistance
Junction-to-case thermal resistance
Thermal Resistance Data
Table 34-1
The average chip-junction temperature, T
where:
From the first equation, the user can derive the estimated lifetime of the chip and decide if a
cooling device is necessary or not. If a cooling device is to be fitted on the chip, the second
equation should be used to compute the resulting average chip-junction temperature T
4.
5.
• θ
• θ
• θ
• P
• T
page
Table 34-1 on page
”Power Consumption” on page
JA
JC
HEAT SINK
A
D
T
T
= ambient temperature (°C).
= device power consumption (W) estimated from data provided in the section
= package thermal resistance, Junction-to-ambient (°C/W), provided in
J
= package thermal resistance, Junction-to-case thermal resistance (°C/W), provided in
J
=
499.
=
T
summarizes the thermal resistance data depending on the package.
T
A
A
= cooling device thermal resistance (°C/W), provided in the device datasheet.
+
+
P (
(
P
D
D
×
×
θ (
θ
HEATSINK
499.
JA
Condition
Still Air
Still Air
)
+
θ
482.
JC
) )
13x13mm 0.8mm pitch
13x13mm 0.8mm pitch
J
, in °C can be obtained from the following:
LFBGA 225
LFBGA 225
Package
35.3
Typ
28
AT91CAP7E
Table 34-1 on
°C/W
°C/W
Unit
Section 33.3
J
in °C.
499