AT91CAP7E-NA-ZJ Atmel, AT91CAP7E-NA-ZJ Datasheet - Page 500

• Manufacturer Part Number: AT91CAP7E-NA-ZJ
• Description: MCU CAP7 FPGA 225LFBGA
• Manufacturer: Atmel
• Series: CAP™r

Specifications of AT91CAP7E-NA-ZJ

• Core Processor: ARM7
• Core Size: 16/32-Bit
• Speed: 80MHz
• Connectivity: EBI/EMI, FPGA, IrDA, SPI, UART/USART, USB
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 32
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: ROM
• Ram Size: 160K x 8
• Voltage - Supply (vcc/vdd): 1.08 V ~ 1.32 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 225-LFBGA
• Processor Series: AT91Mx
• Core: ARM7TDMI
• Data Bus Width: 32 bit
• 3rd Party Development Tools: JTRACE-ARM-2M, MDK-ARM, RL-ARM, ULINK2
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

34.2
225-ball LFBGA Package DrawingSoldering Profile
Table 34-2.
Table 34-3.
Table 34-4.
Table 34-5.
500
Ball Land
Soldering Mask Opening
365.2
Moisture Sensitivity Level
JEDEC Drawing Reference
JESD97 Classification
A1 BALL PAD CORNER
A1 BALL PAD CORNER
Package Drawings
AT91CAP7E
Soldering Information
Device and 225-ball LFBGA Package Maximum Weight
225-ball LFBGA Package Characteristics
Package Reference
e e
15
15
14
14
13
13
BOTTOM VIEW
BOTTOM VIEW
(225 SOLDER BALLS)
(225 SOLDER BALLS)
0.90 REF
0.90 REF
12
12
11
11
TOP VIEW
TOP VIEW
10
10 9 9
D D
8 8
7 7
A1 BALL PAD CORNER
A1 BALL PAD CORNER
6 6
5 5
4 4
3 3
2 2
1 1
e e
M M
A A
B B
C C
D D
E E
F F
G G
H H
K K
L L
N N
P P
R R
J J
E E
X X
0.10
0.10
Y Y
4X
4X
SYMBOL
D
E
A
A1
A2
e
b
mg
0.530 mm +/- 0.03
0.370mm to 0.03 mm
3
MO-205
e1
0.10
0.10
A A
SIDE VIEW
SIDE VIEW
0.25
0.85
0.45
COMMON DIMENSIONS
MIN
(Unit of Measure = mm)
Z Z
–
13.00 BSC
13.00 BSC
0.80 BSC
A2
A2
0.12
0.12
Z Z
NOM
0.50
A1
A1
–
–
–
& & b b
SEATING PLANE
SEATING PLANE
Z Z
& & 0.15 M
& & 0.08 M
0.15 M
0.08 M
MAX
1.70
0.55
–
–
Z Z
Z Z
X X
NOTE
Y Y
3
3
4
8549A–CAP–10/08