C8051F930-GQ Silicon Laboratories Inc, C8051F930-GQ Datasheet - Page 188

IC 8051 MCU 64K FLASH 32-LQFP

C8051F930-GQ

Manufacturer Part Number
C8051F930-GQ
Description
IC 8051 MCU 64K FLASH 32-LQFP
Manufacturer
Silicon Laboratories Inc
Series
C8051F9xxr
Datasheets

Specifications of C8051F930-GQ

Program Memory Type
FLASH
Program Memory Size
64KB (64K x 8)
Package / Case
32-LQFP
Core Processor
8051
Core Size
8-Bit
Speed
25MHz
Connectivity
SMBus (2-Wire/I²C), SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, Temp Sensor, WDT
Number Of I /o
24
Ram Size
4.25K x 8
Voltage - Supply (vcc/vdd)
0.9 V ~ 3.6 V
Data Converters
A/D 23x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
C8051F9x
Core
8051
Data Bus Width
8 bit
Data Ram Size
4.25 KB
Interface Type
I2C/SMBus/SPI/UART
Maximum Clock Frequency
25 MHz
Number Of Programmable I/os
24
Number Of Timers
4
Operating Supply Voltage
0.9 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
PK51, CA51, A51, ULINK2
Development Tools By Supplier
C8051F930DK
Minimum Operating Temperature
- 40 C
On-chip Adc
23-ch x 10-bit
No. Of I/o's
24
Ram Memory Size
4KB
Cpu Speed
25MHz
No. Of Timers
4
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
336-1478 - PLATFORM PROG TOOLSTCK F920,F930336-1477 - PLATFORM PROG TOOLSTCK F920,F930336-1473 - KIT DEV C8051F920,F921,F930,F931336-1472 - BOARD TARGET/PROTO W/C8051F930
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
336-1466

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
C8051F930-GQ
Manufacturer:
SILICON
Quantity:
3 500
Part Number:
C8051F930-GQ
Manufacturer:
Silicon Laboratories Inc
Quantity:
10 000
Part Number:
C8051F930-GQR
Manufacturer:
Silicon Laboratories Inc
Quantity:
10 000
Part Number:
C8051F930-GQR
Manufacturer:
SILICON LABS/芯科
Quantity:
20 000
C8051F93x-C8051F92x
19.1. Programmable Precision Internal Oscillator
All C8051F93x-C8051F92x devices include a programmable precision internal oscillator that may be
selected as the system clock. OSCICL is factory calibrated to obtain a 24.5 MHz frequency. See Section
“4. Electrical Characteristics” on page 43 for complete oscillator specifications.
The precision oscillator supports a spread spectrum mode which modulates the output frequency in order
to reduce the EMI generated by the system. When enabled (SSE = 1), the oscillator output frequency is
modulated by a stepped triangle wave whose frequency is equal to the oscillator frequency divided by 384
(63.8 kHz using the factory calibration). The deviation from the nominal oscillator frequency is +0%, –1.6%,
and the step size is typically 0.26% of the nominal frequency. When using this mode, the typical average
oscillator frequency is lowered from 24.5 MHz to 24.3 MHz.
19.2. Low Power Internal Oscillator
All C8051F93x-C8051F92x devices include a low power internal oscillator that defaults as the system
clock after a system reset. The low power internal oscillator frequency is 20 MHz ± 10% and is
automatically enabled when selected as the system clock and disabled when not in use. See Section
“4. Electrical Characteristics” on page 43 for complete oscillator specifications.
19.3. External Oscillator Drive Circuit
All C8051F93x-C8051F92x devices include an external oscillator circuit that may drive an external crystal,
ceramic resonator, capacitor, or RC network. A CMOS clock may also provide a clock input. Figure 19.1
shows a block diagram of the four external oscillator options. The external oscillator is enabled and
configured using the OSCXCN register.
The external oscillator output may be selected as the system clock or used to clock some of the digital
peripherals (e.g., timers, PCA, etc.). See the data sheet chapters for each digital peripheral for details. See
Section “4. Electrical Characteristics” on page 43 for complete oscillator specifications.
19.3.1. External Crystal Mode
If a crystal or ceramic resonator is used as the external oscillator, the crystal/resonator and a 10 M 
resistor must be wired across the XTAL1 and XTAL2 pins as shown in Figure 19.1, Option 1. Appropriate
loading capacitors should be added to XTAL1 and XTAL2, and both pins should be configured for analog
I/O with the digital output drivers disabled.
Figure 19.2 shows the external oscillator circuit for a 20 MHz quartz crystal with a manufacturer
recommended load capacitance of 12.5 pF. Loading capacitors are "in series" as seen by the crystal and
"in parallel" with the stray capacitance of the XTAL1 and XTAL2 pins. The total value of the each loading
capacitor and the stray capacitance of each XTAL pin should equal 12.5pF x 2 = 25 pF. With a stray
capacitance of 10 pF per pin, the 15 pF capacitors yield an equivalent series capacitance of 12.5 pF
across the crystal.
Note: The recommended load capacitance depends upon the crystal and the manufacturer. Refer to the crystal data
sheet when completing these calculations.
188
Rev. 1.1

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