DF38602RFT10 Renesas Electronics America, DF38602RFT10 Datasheet - Page 315

MCU 3V 16K 32-QFN

DF38602RFT10

Manufacturer Part Number
DF38602RFT10
Description
MCU 3V 16K 32-QFN
Manufacturer
Renesas Electronics America
Series
H8® H8/300H SLPr
Datasheet

Specifications of DF38602RFT10

Core Processor
H8/300H
Core Size
16-Bit
Speed
10MHz
Connectivity
I²C, IrDA, SCI, SSU
Peripherals
POR, PWM, WDT
Number Of I /o
13
Program Memory Size
16KB (16K x 8)
Program Memory Type
FLASH
Ram Size
1K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 6x10b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
32-QFN
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Other names
HD64F38602RFT10
HD64F38602RFT10

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF38602RFT10V
Manufacturer:
Renesas Electronics America
Quantity:
135
14.8.8
Make sure that transmit and receive operations have completely finished before carrying out state
transition processing.
14.8.9
In subactive or subsleep mode, the SCI3 can operate only when the CPU clock is φ
SA0 bits in SYSCR2 should be set to 1.
14.8.10
When serial communication interface 3 is used, the system clock oscillator or subclock oscillator
must be used. Do not use the on-chip oscillator. For details on selecting the system clock oscillator
or on-chip oscillator, see section 4.2.4, On-Chip Oscillator Selection Method. For details on
selecting the subclock oscillator or on-chip oscillator, see section 4.1.1, Oscillator Control
Register (OSCCR).
Transmit and Receive Operations when Making State Transition
Setting in Subactive or Subsleep Mode
Oscillator when Serial Communication Interface 3 is Used
Section 14 Serial Communication Interface 3 (SCI3, IrDA)
Rev. 3.00 May 15, 2007 Page 281 of 518
REJ09B0152-0300
W
. The SA1 and

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