DF38602RFT10 Renesas Electronics America, DF38602RFT10 Datasheet - Page 66

MCU 3V 16K 32-QFN

DF38602RFT10

Manufacturer Part Number
DF38602RFT10
Description
MCU 3V 16K 32-QFN
Manufacturer
Renesas Electronics America
Series
H8® H8/300H SLPr
Datasheet

Specifications of DF38602RFT10

Core Processor
H8/300H
Core Size
16-Bit
Speed
10MHz
Connectivity
I²C, IrDA, SCI, SSU
Peripherals
POR, PWM, WDT
Number Of I /o
13
Program Memory Size
16KB (16K x 8)
Program Memory Type
FLASH
Ram Size
1K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 6x10b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
32-QFN
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Other names
HD64F38602RFT10
HD64F38602RFT10

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF38602RFT10V
Manufacturer:
Renesas Electronics America
Quantity:
135
Section 2 CPU
2.6
CPU operation is synchronized by a system clock (φ) or a subclock (φ
edge of φ or φ
2.6.1
Access to on-chip memory takes place in two states. The data bus width is 16 bits, allowing access
in byte or word size. Figure 2.9 shows the on-chip memory access cycle.
Rev. 3.00 May 15, 2007 Page 32 of 516
REJ09B0152-0300
Access to On-Chip Memory (RAM, ROM)
Basic Bus Cycle
SUB
to the next rising edge is called one state. A bus cycle consists of two states.
φ or φ
Internal address bus
Internal read signal
Internal data bus
(read access)
Internal write signal
Internal data bus
(write access)
SUB
Figure 2.9 On-Chip Memory Access Cycle
T
1
state
Bus cycle
Address
Write data
Read data
T
2
state
SUB
). The period from a rising

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