M30624FGNGP#D5 Renesas Electronics America, M30624FGNGP#D5 Datasheet - Page 188

IC M16C MCU FLASH 256K 100LQFP

M30624FGNGP#D5

Manufacturer Part Number
M30624FGNGP#D5
Description
IC M16C MCU FLASH 256K 100LQFP
Manufacturer
Renesas Electronics America
Series
M16C™ M16C/60r
Datasheet

Specifications of M30624FGNGP#D5

Core Processor
M16C/60
Core Size
16-Bit
Speed
16MHz
Connectivity
SIO, UART/USART
Peripherals
DMA, PWM, WDT
Number Of I /o
85
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
20K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 18x10b, D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 85°C
Package / Case
100-LQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
M30624FGNGP#D5M30624FGNGP
Manufacturer:
RENESAS/瑞萨
Quantity:
20 000
Company:
Part Number:
M30624FGNGP#D5M30624FGNGP U3
Manufacturer:
RENESAS
Quantity:
1 000
Company:
Part Number:
M30624FGNGP#D5
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Company:
Part Number:
M30624FGNGP#D5M30624FGNGP#U5
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Electrical characteristics
Switching characteristics (referenced to V
85
Table 1.26.23. Memory expansion and microprocessor modes
Note 2: Specify a product of -40°C to 85°C to use it.
Note 1: Calculated according to the BCLK frequency as follows:
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
h(BCLK-AD)
h(RD-AD)
d(BCLK-CS)
h(BCLK-CS)
h(RD-CS)
d(BCLK-DB)
h(BCLK-DB)
d(BCLK-ALE)
h(BCLK-ALE)
d(AD-RD)
dZ(RD-AD)
d(BCLK-AD)
h(WR-AD)
h(WR-CS)
d(BCLK-RD)
h(BCLK-RD)
d(BCLK-WR)
h(BCLK-WR)
d(DB-WR)
h(WR-DB)
d(AD-ALE)
h(ALE-AD)
d(AD-WR)
o
Symbol
C (Note 2), CM15 = “1” unless otherwise specified)
th(WR – AD) =
th(RD – CS) =
th(WR – CS) =
td(DB – WR) =
th(WR – DB) =
td(AD – ALE) =
th(RD – AD) =
Address output delay time
Chip select output hold time (WR standard)
RD signal output delay time
RD signal output hold time
WR signal output delay time
Data output delay time (BCLK standard)
Data output hold time (BCLK standard)
Data output delay time (WR standard)
Data output hold time (WR standard)
ALE signal output hold time (BCLK standard)
Address output floating start time
Address output hold time (BCLK standard)
Address output hold time (RD standard)
Address output hold time (WR standard)
Chip select output delay time
Chip select output hold time (BCLK standard)
Chip select output hold time (RD standard)
WR signal output hold time
ALE signal output delay time (BCLK standard)
ALE signal output delay time (Address standard)
ALE signal output hold time (Adderss standard)
Post-address RD signal output delay time
Post-address WR signal output delay time
(when accessing external memory area with wait, and select multiplexed bus)
f(BCLK) X 2
f(BCLK) X 2
f(BCLK) X 2
f(BCLK) X 2
f(BCLK) X 2
f(BCLK) X 2
f(BCLK) X 2
10
Parameter
10
10
10
10
10
10
9
X 3
9
9
9
9
9
9
+ 0
+ 0
+ 0
+ 0
+ 0
– 50
– 40
[ns]
[ns]
[ns]
[ns]
[ns]
[ns]
[ns]
CC
= 3.3V, V
Measuring condition
Figure 1.26.1
SS
= 0V at Topr = – 20
SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER
(Note1)
(Note1)
(Note1)
(Note1)
(Note1)
(Note1)
(Note1)
Min.
– 4
30
Standard
4
4
0
0
4
0
0
Max.
50
50
o
50
40
40
40
C to 85
8
M16C / 62N Group
Mitsubishi microcomputers
Unit
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
o
C / – 40
o
C to
185

Related parts for M30624FGNGP#D5