M30624FGNGP#D5 Renesas Electronics America, M30624FGNGP#D5 Datasheet - Page 246

• Manufacturer Part Number: M30624FGNGP#D5
• Description: IC M16C MCU FLASH 256K 100LQFP
• Manufacturer: Renesas Electronics America
• Series: M16C™ M16C/60r

Specifications of M30624FGNGP#D5

• Core Processor: M16C/60
• Core Size: 16-Bit
• Speed: 16MHz
• Connectivity: SIO, UART/USART
• Peripherals: DMA, PWM, WDT
• Number Of I /o: 85
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 20K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 18x10b, D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 85°C
• Package / Case: 100-LQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

Package Outline
Package Outline
100P6S-A
100P6Q-A
LQFP100-P-1414-0.50
QFP100-P-1420-0.65
EIAJ Package Code
EIAJ Package Code
25
1
30
1
100
26
100
31
b
e
x
y
H
MMP
MMP
D
H
D
D
M
D
e
JEDEC Code
JEDEC Code
–
b
–
81
50
50
76
80
51
y
75
51
x
F
F
M
Weight(g)
Weight(g)
1.58
0.63
Lead Material
Lead Material
Detail F
A
A
Alloy 42
Cu Alloy
Detail F
L
1
Lp
L
L
SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER
1
L
Plastic 100pin 14 14mm body LQFP
Plastic 100pin 14 20mm body QFP
Symbol
Symbol
M
H
H
M
A
A
L
b
M
M
A
D
E
I
H
H
I
b
c
e
L
x
y
A
A
Lp
L
A3
b
2
2
A
D
E
I
D
E
1
2
b
c
e
L
x
y
1
2
D
E
2
D
E
1
2
1
2
D
E
Recommended Mount Pad
Recommended Mount Pad
l
2
M16C / 62N Group
13.8
19.8
22.5
16.5
Dimension in Millimeters
Mitsubishi microcomputers
15.8
13.9
13.9
15.8
Min
Dimension in Millimeters
0
0.25
0.13
0.4
1.3
0
Min
0
0.13
0.105
0.3
0.45
0.9
–
–
–
–
–
–
–
–
–
0
–
–
–
–
–
–
–
–
–
–
M
D
M
14.0
20.0
16.8
22.8
14.6
20.6
D
Nom
14.0
14.0
16.0
16.0
14.4
14.4
0.3
0.15
0.65
0.35
0.1
2.8
0.6
1.4
Nom
0.1
1.4
0.18
0.125
0.5
0.5
1.0
0.25
0.225
–
–
–
–
0.6
–
–
–
–
–
–
14.2
17.1
20.2
23.1
10
Max
14.1
14.1
16.2
16.2
0.2
3.05
0.2
0.4
0.8
0.13
0.1
10
Max
0.175
–
–
–
–
–
–
–
1.7
0.2
0.28
0.7
0.75
0.08
0.1
–
–
–
–
–
–
–
–
243