HD6477021X20V Renesas Electronics America, HD6477021X20V Datasheet - Page 177

MCU 5V 32K PB-FREE 100-TQFP

HD6477021X20V

Manufacturer Part Number
HD6477021X20V
Description
MCU 5V 32K PB-FREE 100-TQFP
Manufacturer
Renesas Electronics America
Series
SuperH® SH7020r
Datasheet

Specifications of HD6477021X20V

Core Processor
SH-1
Core Size
32-Bit
Speed
20MHz
Connectivity
EBI/EMI, SCI
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
32
Program Memory Size
32KB (32K x 8)
Program Memory Type
OTP
Ram Size
1K x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Data Converters
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HD6477021X20V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
For details on bus cycles when external spaces are accessed, see section 8.4, External Memory
Space Access, section 8.5, DRAM Space Access, and section 8.6, Address/Data Multiplexed I/O
Space Access.
Accesses of on-chip spaces are as follows: On-chip peripheral module spaces (area 5 when address
bit A27 is 1) are always 3 states, regardless of the WCR, with no WAIT signal sampling. Accesses
of on-chip ROM (area 0 when MD2–MD0 are 010) and on-chip RAM (area 7 when address bit
A27 is 0) are always performed in 1 state, regardless of the WCR, with no WAIT signal sampling.
) are not observed when the WAIT signal is input
If the bus timing specifications (t
and t
WTS
WTH
in external space access, this will simply mean that WAIT signal assertion and negation will not
be detected, but will not result in misoperation. Note, however, that the inability to detect WAIT
signal assertion may result in a problem with memory access due to insertion of an insufficient
number of waits.
8.10
Bus Arbitration
The SuperH microcomputer can release the bus to external devices when they request the bus. It
has two internal bus masters, the CPU and the DMAC. Priorities for releasing the bus for these
two are as follows.
Bus request from external device > refresh > DMAC > CPU
Thus, an external device has priority when it generates a bus request, even when the DMAC is
doing a burst transfer.
Note that when a refresh request is generated while the bus is released to an external device,
BACK becomes high level and the bus right can be acquired to perform the refresh upon receipt of
a BREQ = high level response from the external device. Input all bus requests from external
devices to the BREQ pin. The signal indicating that the bus has been released is output from the
BACK pin. Figure 8.35 illustrates the bus release procedure.
RENESAS 157

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