MC9S12XDP512CAL Freescale, MC9S12XDP512CAL Datasheet - Page 1148

MC9S12XDP512CAL

Manufacturer Part Number
MC9S12XDP512CAL
Description
Manufacturer
Freescale
Datasheet

Specifications of MC9S12XDP512CAL

Cpu Family
HCS12
Device Core Size
16b
Frequency (max)
40MHz
Interface Type
CAN/I2C/SCI/SPI
Total Internal Ram Size
32KB
# I/os (max)
91
Number Of Timers - General Purpose
12
Operating Supply Voltage (typ)
2.5/5V
Operating Supply Voltage (max)
2.75/5.5V
Operating Supply Voltage (min)
2.35/3.15V
On-chip Adc
2(16-chx10-bit)
Instruction Set Architecture
CISC
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
112
Package Type
LQFP
Program Memory Type
Flash
Program Memory Size
512KB
Lead Free Status / RoHS Status
Compliant

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Chapter 28 256 Kbyte Flash Module (S12XFTX256K2V1)
28.1.3
Program, erase, erase verify, and data compress operations (please refer to
Command Operations”
28.1.4
A block diagram of the Flash module is shown in
28.2
The Flash module contains no signals that connect off-chip.
1150
Security feature to prevent unauthorized access to the Flash memory
Code integrity check using built-in data compression
External Signal Description
Oscillator
Clock
Command
Request
Interrupt
Modes of Operation
Block Diagram
for details).
FTX256K2
Clock
Divider
Figure 28-1. FTX256K2 Block Diagram
Command Pipeline
MC9S12XDP512 Data Sheet, Rev. 2.21
cmd2
addr2
data2_0
data2_1
Registers
Protection
Interface
Security
Flash
FCLK
cmd1
addr1
data1_0
data1_1
Figure
28-1.
Flash Block 0
64K * 16 Bits
Flash Block 1
64K * 16 Bits
Section 28.4.1, “Flash
sector 127
sector 127
sector 0
sector 1
sector 0
sector 1
Freescale Semiconductor

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