MC9S12XDP512CAL Freescale, MC9S12XDP512CAL Datasheet - Page 786

• Manufacturer Part Number: MC9S12XDP512CAL
• Manufacturer: Freescale

Specifications of MC9S12XDP512CAL

• Cpu Family: HCS12
• Device Core Size: 16b
• Frequency (max): 40MHz
• Interface Type: CAN/I2C/SCI/SPI
• Total Internal Ram Size: 32KB
• # I/os (max): 91
• Number Of Timers - General Purpose: 12
• Operating Supply Voltage (typ): 2.5/5V
• Operating Supply Voltage (max): 2.75/5.5V
• Operating Supply Voltage (min): 2.35/3.15V
• On-chip Adc: 2(16-chx10-bit)
• Instruction Set Architecture: CISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 112
• Package Type: LQFP
• Program Memory Type: Flash
• Program Memory Size: 512KB
• Lead Free Status / RoHS Status: Compliant

Chapter 21 External Bus Interface (S12XEBIV2)
21.1.3
Figure 21-1
21.2
The user is advised to refer to the SoC section for port configuration and location of external bus signals.
Table 21-1
and PIM section for reset states of these pins and associated pull-ups or pull-downs.
788
External Signal Description
outlines the pin names and gives a brief description of their function. Refer to the SoC section
Block Diagram
is a block diagram of the XEBI with all related I/O signals.
The following external bus related signals are described in other sections:
CS2, CS1, CS0 (chip selects) — S12X_MMC section
ECLK, ECLKX2 (free-running clocks) — PIM section
TAGHI, TAGLO (tag inputs) — PIM section, S12X_DBG section
EWAIT
MC9S12XDP512 Data Sheet, Rev. 2.21
Figure 21-1. XEBI Block Diagram
XEBI
NOTE
ADDR[22:0]
DATA[15:0]
IVD[15:0]
LSTRB
R/W
UDS
LDS
RE
WE
ACC[2:0]
IQSTAT[3:0]
Freescale Semiconductor