MC9S12XDP512CAL Freescale, MC9S12XDP512CAL Datasheet - Page 572

• Manufacturer Part Number: MC9S12XDP512CAL
• Manufacturer: Freescale

Specifications of MC9S12XDP512CAL

• Cpu Family: HCS12
• Device Core Size: 16b
• Frequency (max): 40MHz
• Interface Type: CAN/I2C/SCI/SPI
• Total Internal Ram Size: 32KB
• # I/os (max): 91
• Number Of Timers - General Purpose: 12
• Operating Supply Voltage (typ): 2.5/5V
• Operating Supply Voltage (max): 2.75/5.5V
• Operating Supply Voltage (min): 2.35/3.15V
• On-chip Adc: 2(16-chx10-bit)
• Instruction Set Architecture: CISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 112
• Package Type: LQFP
• Program Memory Type: Flash
• Program Memory Size: 512KB
• Lead Free Status / RoHS Status: Compliant

Chapter 15 Background Debug Module (S12XBDMV2)
15.2
A single-wire interface pin called the background debug interface (BKGD) pin is used to communicate
with the BDM system. During reset, this pin is a mode select input which selects between normal and
special modes of operation. After reset, this pin becomes the dedicated serial interface pin for the
background debug mode.
15.3
15.3.1
Table 15-1
572
External Signal Description
Memory Map and Register Definition
shows the BDM memory map when BDM is active.
Module Memory Map
0x7FFF0C–0x7FFF0E
0x7FFF00–0x7FFF0B
0x7FFF10–0x7FFFFF
Global Address
0x7FFF0F
MC9S12XDP512 Data Sheet, Rev. 2.21
Table 15-1. BDM Memory Map
Family ID (part of BDM firmware ROM)
BDM firmware ROM
BDM firmware ROM
BDM registers
Module
Freescale Semiconductor
(Bytes)
Size
240
12
3
1