MC9S12XDP512CAL Freescale, MC9S12XDP512CAL Datasheet - Page 1243
MC9S12XDP512CAL
Manufacturer Part Number
MC9S12XDP512CAL
Description
Manufacturer
Freescale
Datasheet
1.MC9S12XDP512CAL.pdf
(1348 pages)
Specifications of MC9S12XDP512CAL
Cpu Family
HCS12
Device Core Size
16b
Frequency (max)
40MHz
Interface Type
CAN/I2C/SCI/SPI
Total Internal Ram Size
32KB
# I/os (max)
91
Number Of Timers - General Purpose
12
Operating Supply Voltage (typ)
2.5/5V
Operating Supply Voltage (max)
2.75/5.5V
Operating Supply Voltage (min)
2.35/3.15V
On-chip Adc
2(16-chx10-bit)
Instruction Set Architecture
CISC
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
112
Package Type
LQFP
Program Memory Type
Flash
Program Memory Size
512KB
Lead Free Status / RoHS Status
Compliant
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The values for thermal resistance are achieved by package simulations
Junction to ambient thermal resistance,
horizontal configuration in natural convection.
Maskset L15Y / M84E in LQFP112 or QFP80
Maskset M42E in LQFP112 or QFP80
Junction to ambient thermal resistance,
horizontal configuration in natural convection.
Junction to case thermal resistance was simulated to be equivalent to the measured values using the cold plate technique with
the cold plate temperature used as the “case” temperature. This basic cold plate measurement technique is described by
MIL-STD 883D, Method 1012.1. This is the correct thermal metric to use to calculate thermal performance when the package
is being used with a heat sink.
Thermal characterization parameter
case as defined in JESD51-2.
enviroment.
1
2
3
4
5
6
7
8
9
C
T
T
T
T
T
T
T
T
T
Thermal resistance LQFP144, single sided PCB
Thermal resistance LQFP144, double sided PCB
with 2 internal planes
Junction to Board LQFP 144
Junction to Case LQFP 144
Junction to Package Top LQFP144
Thermal resistance LQFP112, single sided PCB
Thermal resistance LQFP112, double sided PCB
with 2 internal planes
Junction to Board LQFP112
Junction to Case LQFP112
Junction to Package Top LQFP112
Thermal resistance QFP 80, single sided PCB
Thermal resistance QFP 80, double sided PCB
with 2 internal planes
Junction to Board QFP 80
Junction to Case QFP 80
Junction to Package Top QFP 80
3
5
3
JT
Table A-5. Thermal Package Characteristics
is a useful value to use to estimate junction temperature in a steady state customer
Rating
6
4
JT
4
is the “resistance” from junction to reference point thermocouple on top center of the
MC9S12XDP512 Data Sheet, Rev. 2.21
JA
JA
7
was simulated to be equivalent to the JEDEC specification JESD51-2 in a
was simulated to be equivalent to the JEDEC specification JESD51-7 in a
5
5
LQFP144
LQFP112
2
QFP80
2
2
Symbol
JC
JC
JC
JA
JA
JB
JA
JA
JB
JA
JA
JB
JT
JT
JT
Min
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
1
Appendix A Electrical Characteristics
Typ
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
43
32
22
45
33
19
11
7
Max
3
7/4
3
3/2
3
3
3
3
3
3
41
32
22
/11
3
/49
3
/39
/27
/49
/36
/20
/14
4
4
4
4
4
4
4
4
Unit
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
1245
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