MC9S12XDP512CAL Freescale, MC9S12XDP512CAL Datasheet - Page 651

MC9S12XDP512CAL

Manufacturer Part Number
MC9S12XDP512CAL
Description
Manufacturer
Freescale
Datasheet

Specifications of MC9S12XDP512CAL

Cpu Family
HCS12
Device Core Size
16b
Frequency (max)
40MHz
Interface Type
CAN/I2C/SCI/SPI
Total Internal Ram Size
32KB
# I/os (max)
91
Number Of Timers - General Purpose
12
Operating Supply Voltage (typ)
2.5/5V
Operating Supply Voltage (max)
2.75/5.5V
Operating Supply Voltage (min)
2.35/3.15V
On-chip Adc
2(16-chx10-bit)
Instruction Set Architecture
CISC
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
112
Package Type
LQFP
Program Memory Type
Flash
Program Memory Size
512KB
Lead Free Status / RoHS Status
Compliant

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Chapter 18
Memory Mapping Control (S12XMMCV3)
18.1
Introduction
This section describes the functionality of the module mapping control (MMC) sub-block of the S12X
platform. The block diagram of the MMC is shown in
Figure
18-1.
The MMC module controls the multi-master priority accesses, the selection of internal resources and
external space. Internal buses, including internal memories and peripherals, are controlled in this module.
The local address space for each master is translated to a global memory space.
MC9S12XDP512 Data Sheet, Rev. 2.21
Freescale Semiconductor
651

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