HD6417750RF240DV Renesas Electronics America, HD6417750RF240DV Datasheet - Page 668

• Manufacturer Part Number: HD6417750RF240DV
• Description: MPU 3V 16K I-TEMP,PB-FREE 208-QF
• Manufacturer: Renesas Electronics America
• Series: SuperH® SH7750r

Specifications of HD6417750RF240DV

• Core Processor: SH-4
• Core Size: 32-Bit
• Speed: 240MHz
• Connectivity: EBI/EMI, FIFO, SCI, SmartCard
• Peripherals: DMA, POR, WDT
• Number Of I /o: 28
• Program Memory Type: ROMless
• Ram Size: 48K x 8
• Voltage - Supply (vcc/vdd): 1.4 V ~ 1.6 V
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 208-QFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -
• Data Converters: -

Section 14 Direct Memory Access Controller (DMAC)
Table 14.7 Relationship between DMA Transfer Type, Request Mode, and Bus Mode
Address
Mode
Single
Dual
Legend:
32B:
B:
C:
External: External request
Internal: Auto-request or on-chip peripheral module request
Notes: 1. External request, auto-request, or on-chip peripheral module request (TMU input
Rev.7.00 Oct. 10, 2008 Page 582 of 1074
REJ09B0366-0700
2. Auto-request, or on-chip peripheral module request possible. If the transfer request
3. When the transfer request source is the SCI (SCIF), only cycle steal mode can be used.
4. Access size permitted for the on-chip peripheral module register that is the transfer
5. When the transfer request is an external request, only channels 0 and 1 can be used.
6. In DDT mode, transfer requests can be accepted for all channels from external devices
Burst
Cycle steal
32-byte burst transfer
capture interrupt request) possible. In the case of an on-chip peripheral module request,
it is not possible to specify external memory data transfer with the SCI (SCIF) as the
transfer request source.
source is the SCI (SCIF), either the transfer source must be SCRDR1 (SCFRDR2) or
the transfer destination must be SCTDR1 (SCFTDR2).
source or transfer destination.
capable of DTR format output.
Type of Transfer
External device with DACK
and external memory
External device with DACK
and memory-mapped
external device
External memory and
external memory
External memory and
memory-mapped external
device
Memory-mapped external
device and memory-mapped
external device
External memory and
on-chip peripheral module
Memory-mapped external
device and on-chip
peripheral module
Request
Mode
External
External
Internal *
External *
Internal *
External *
Internal *
External *
Internal *
Internal *
1
1
1
2
2
7
7
7
Bus
Mode
B/C
B/C
B/C
B/C
B/C
B/C *
B/C *
3
3
Transfer Size
(Bits)
8/16/32/64/32B 0, 1 (2, 3) *
8/16/32/64/32B 0, 1 (2, 3) *
8/16/32/64/32B 0 to 3 *
8/16/32/64/32B 0 to 3 *
8/16/32/64/32B 0 to 3 *
8/16/32/64 *
8/16/32/64 *
4
4
Usable
Channels
0 to 3 *
0 to 3 *
5
5
5
5
5
*
*
*
*
*
6
6
6
6
6
6
6