HD64F3684FP Renesas Electronics America, HD64F3684FP Datasheet - Page 20

IC H8 MCU FLASH 32K 64LQFP

HD64F3684FP

Manufacturer Part Number
HD64F3684FP
Description
IC H8 MCU FLASH 32K 64LQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300H Tinyr
Datasheet

Specifications of HD64F3684FP

Core Processor
H8/300H
Core Size
16-Bit
Speed
20MHz
Connectivity
I²C, SCI
Peripherals
PWM, WDT
Number Of I /o
45
Program Memory Size
32KB (32K x 8)
Program Memory Type
FLASH
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
64-LQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-

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18.5 A/D Conversion Accuracy Definitions .............................................................................. 346
18.6 Usage Notes ....................................................................................................................... 348
Section 19 EEPROM......................................................................................... 349
19.1 Features.............................................................................................................................. 349
19.2 Input/Output Pins............................................................................................................... 351
19.3 Register Description .......................................................................................................... 351
19.4 Operation ........................................................................................................................... 352
19.5 Usage Notes ....................................................................................................................... 359
Section 20 Power-On Reset and Low-Voltage Detection Circuits (Optional).. 361
20.1 Features.............................................................................................................................. 361
20.2 Register Descriptions......................................................................................................... 362
20.3 Operation ........................................................................................................................... 365
Section 21 Power Supply Circuit ...................................................................... 371
21.1 When Using Internal Power Supply Step-Down Circuit ................................................... 371
21.2 When Not Using Internal Power Supply Step-Down Circuit............................................. 372
Rev.5.00 Nov. 02, 2005 Page xviii of xxxii
18.4.2 Scan Mode ............................................................................................................ 343
18.4.3 Input Sampling and A/D Conversion Time .......................................................... 344
18.4.4 External Trigger Input Timing.............................................................................. 345
18.6.1 Permissible Signal Source Impedance .................................................................. 348
18.6.2 Influences on Absolute Accuracy ......................................................................... 348
19.3.1 EEPROM Key Register (EKR)............................................................................. 351
19.4.1 EEPROM Interface............................................................................................... 352
19.4.2 Bus Format and Timing ........................................................................................ 352
19.4.3 Start Condition...................................................................................................... 352
19.4.4 Stop Condition ...................................................................................................... 353
19.4.5 Acknowledge ........................................................................................................ 353
19.4.6 Slave Addressing .................................................................................................. 353
19.4.7 Write Operations................................................................................................... 354
19.4.8 Acknowledge Polling............................................................................................ 356
19.4.9 Read Operation ..................................................................................................... 356
19.5.1 Data Protection at V
19.5.2 Write/Erase Endurance ......................................................................................... 359
19.5.3 Noise Suppression Time ....................................................................................... 359
20.2.1 Low-Voltage-Detection Control Register (LVDCR)............................................ 362
20.2.2 Low-Voltage-Detection Status Register (LVDSR)............................................... 364
20.3.1 Power-On Reset Circuit ........................................................................................ 365
20.3.2 Low-Voltage Detection Circuit............................................................................. 366
CC
On/Off............................................................................... 359

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