mcf5272 Freescale Semiconductor, Inc, mcf5272 Datasheet - Page 21

• Manufacturer Part Number: mcf5272
• Description: Mcf5272 Coldfire Integrated Microprocessor User
• Manufacturer: Freescale Semiconductor, Inc

MOTOROLA
22.1
22.2
23.1
23.1.1
23.1.2
23.1.3
23.2
23.2.1
23.3
23.3.1
23.3.2
23.3.3
23.4
23.5
23.6
23.6.1
23.6.2
23.6.3
23.6.4
23.7
23.8
23.9
23.10
23.11
23.12
23.13
23.14
A.1
Paragraph
Number
Pinout ................................................................................................................ 22-1
Package Dimensions ......................................................................................... 22-2
Maximum Ratings............................................................................................. 23-1
DC Electrical Specifications ............................................................................. 23-3
AC Electrical Specifications ............................................................................. 23-5
Debug AC Timing Specifications................................................................... 23-12
SDRAM Interface Timing Specifications....................................................... 23-13
Fast Ethernet AC Timing Specifications ........................................................ 23-15
Timer Module AC Timing Specifications ...................................................... 23-18
UART Modules AC Timing Specifications.................................................... 23-19
PLIC Module: IDL and GCI Interface Timing Specifications ....................... 23-20
General-Purpose I/O Port AC Timing Specifications..................................... 23-25
USB Interface AC Timing Specifications....................................................... 23-25
IEEE 1149.1 (JTAG) AC Timing Specifications ........................................... 23-26
QSPI Electrical Specifications........................................................................ 23-27
PWM Electrical Specifications ....................................................................... 23-28
List of Memory Map Tables .............................................................................. A-1
Supply, Input Voltage, and Storage Temperature......................................... 23-1
Operating Temperature ................................................................................. 23-2
Resistance ..................................................................................................... 23-2
Output Driver Capability and Loading ......................................................... 23-3
Clock Input and Output Timing Specifications ............................................ 23-5
Processor Bus Input Timing Specifications.................................................. 23-6
Processor Bus Output Timing Specifications ............................................... 23-7
MII Receive Signal Timing (E_RxD[3:0], E_RxDV, E_RxER, and
MII Transmit Signal Timing (E_TxD[3:0], E_TxEN, E_TxER,
MII Async Inputs Signal Timing (CRS and COL) ..................................... 23-17
MII Serial Management Channel Timing (MDIO and MDC).................... 23-17
E_RxCLK).............................................................................................. 23-15
E_TxCLK) .............................................................................................. 23-16
Electrical Characteristics
List of Memory Maps
Mechanical Data
CONTENTS
Appendix A
Chapter 22
Chapter 23
Contents
Title
Number
Page
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