DF3048BVX25V Renesas Electronics America, DF3048BVX25V Datasheet - Page 650

MCU 3/5V 128K PB-FREE 100-TQFP

DF3048BVX25V

Manufacturer Part Number
DF3048BVX25V
Description
MCU 3/5V 128K PB-FREE 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheets

Specifications of DF3048BVX25V

Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, PWM, WDT
Number Of I /o
70
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF3048BVX25V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Section 18 ROM (H8/3048F-ONE: Single Power Supply, H8/3048B Mask ROM Version)
Rev. 3.00 Sep 27, 2006 page 622 of 872
REJ09B0325-0300
Notes:
V
FWE
MD
RXD1 *
RES
SWE bit
CC
2
to MD
Flash memory access disabled period
(x: Wait time after SWE setting, y: wait time after SWE clearing)
Flash memory reprogrammable period
(Flash memory program execution and data read, other than verify, are disabled.)
3
1. Always fix the level by pulling down or pulling up the mode pins (MD
2. See section 21.1.6, Flash Memory Characteristics.
3. For pins RXD1 and TXD1, use on-board pull-up.
0
*
until powering off, except for mode switching.
1
,
Figure 18.18 Powering On/Off Timing (Boot Mode)
t
OSC1
t
MDS
t
SWE set
MDS
Wait time: x
Programming
and erase
possible
Wait time: y
Min 0 s
SWE clear
*
2
2
to MD
Min 0 s
0
)

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