DF3048BVX25V Renesas Electronics America, DF3048BVX25V Datasheet - Page 894

MCU 3/5V 128K PB-FREE 100-TQFP

DF3048BVX25V

Manufacturer Part Number
DF3048BVX25V
Description
MCU 3/5V 128K PB-FREE 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheets

Specifications of DF3048BVX25V

Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, PWM, WDT
Number Of I /o
70
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF3048BVX25V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Appendix D Pin States
Reset in T2 State
Figure D.2 is a timing diagram for the case in which RES goes low during the T2 state of an
external memory access cycle. As soon as RES goes low, all ports are initialized to the input state.
AS, RD, HWR, and LWR go high, and the data bus goes to the high-impedance state. The address
bus is initialized to the low output level 0.5 state after the low level of RES is sampled. The same
timing applies when a reset occurs during a wait state (T
Rev. 3.00 Sep 27, 2006 page 866 of 872
REJ09B0325-0300
RES
Internal
reset signal
Address bus
CS
CS
AS
RD (read access)
HWR, LWR
(write access)
Data bus
(write access)
I/O port
0
7
to CS
Figure D.2 Reset during Memory Access (Reset during T2 State)
1
Access to external address
T1
T2
W
).
T3
H'000000
High-impedance
High-impedance
High-impedance

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