HD6413003TF16V Renesas Electronics America, HD6413003TF16V Datasheet - Page 170

MCU 5V 0K PB-FREE 112-QFP

HD6413003TF16V

Manufacturer Part Number
HD6413003TF16V
Description
MCU 5V 0K PB-FREE 112-QFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheet

Specifications of HD6413003TF16V

Core Size
16-Bit
Oscillator Type
Internal
Core Processor
H8/300H
Speed
16MHz
Connectivity
SCI
Peripherals
DMA, PWM, WDT
Number Of I /o
50
Program Memory Type
ROMless
Ram Size
512 x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 8x10b
Operating Temperature
-20°C ~ 75°C
Package / Case
112-QFP
No. Of I/o's
58
Ram Memory Size
512Byte
Cpu Speed
16MHz
No. Of Timers
11
No. Of Pwm Channels
4
Digital Ic Case Style
QFP
Supply Voltage
RoHS Compliant
Controller Family/series
H8/300H
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HD6413003TF16V
Manufacturer:
ITT
Quantity:
12 000
Part Number:
HD6413003TF16V
Manufacturer:
RENESAS
Quantity:
36
Part Number:
HD6413003TF16V
Manufacturer:
RENESAS/瑞萨
Quantity:
20 000
Self-Refresh Mode: Some DRAM devices have a self-refresh function. After the SRFMD bit is
set to 1 in RFSHCR, when a transition to software standby mode occurs, the CAS and RAS
outputs go low in that order so that the DRAM self-refresh function can be used. On exit from
software standby mode, the CAS and RAS outputs both go high.
Table 7-7 shows the pin states in software standby mode. Figure 7-6 shows the signal output
timing.
Table 7-7 Pin States in Software Standby Mode (1) (PSRAME = 0, DRAME = 1)
Signal
HWR
LWR
RD
CS
RFSH
3
CAS/WE = 0
High-impedance
High-impedance
High-impedance
High
High
SRFMD = 0
CAS/WE = 1
High
High
High-impedance
High-impedance
High-impedance
Software Standby Mode
150
CAS/WE = 0
High
High
Low
Low
Low
SRFMD = 1 (self-refresh mode)
CAS/WE = 1
Low
Low
High
Low
Low

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