C8051F930-TB Silicon Laboratories Inc, C8051F930-TB Datasheet - Page 112

• Manufacturer Part Number: C8051F930-TB
• Description: BOARD TARGET/PROTO W/C8051F930
• Manufacturer: Silicon Laboratories Inc
• Type: MCUr

Specifications of C8051F930-TB

• Contents: Board
• Processor To Be Evaluated: C8051F930
• Processor Series: C8051F9xx
• Data Bus Width: 8 bit
• Interface Type: I2C, UART, SPI
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Operating Supply Voltage: 0.9 V to 3.6 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With/related Products: C8051F930
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 336-1472

C8051F93x-C8051F92x
9.2.1.3. Stack
A programmer's stack can be located anywhere in the 256-byte data memory. The stack area is desig-
nated using the Stack Pointer (SP) SFR. The SP will point to the last location used. The next value pushed
on the stack is placed at SP+1 and then SP is incremented. A reset initializes the stack pointer to location
0x07. Therefore, the first value pushed on the stack is placed at location 0x08, which is also the first regis-
ter (R0) of register bank 1. Thus, if more than one register bank is to be used, the SP should be initialized
to a location in the data memory not being used for data storage. The stack depth can extend up to
256 bytes.
9.2.2. External RAM
There are 4096 bytes of on-chip RAM mapped into the external data memory space. All of these address
locations may be accessed using the external move instruction (MOVX) and the data pointer (DPTR), or
using MOVX indirect addressing mode (such as @R1) in combination with the EMI0CN register. Additional
off-chip memory or memory-mapped devices may be mapped to the external memory address space and
accessed using the external memory interface. See Section “10. External Data Memory Interface and On-
Chip XRAM” on page 113 for further details.
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