MCF5272VM66 Freescale Semiconductor, MCF5272VM66 Datasheet - Page 432

IC MPU 66MHZ COLDFIRE 196-MAPBGA

MCF5272VM66

Manufacturer Part Number
MCF5272VM66
Description
IC MPU 66MHZ COLDFIRE 196-MAPBGA
Manufacturer
Freescale Semiconductor
Series
MCF527xr
Datasheets

Specifications of MCF5272VM66

Core Processor
Coldfire V2
Core Size
32-Bit
Speed
66MHz
Connectivity
EBI/EMI, Ethernet, I²C, SPI, UART/USART, USB
Peripherals
DMA, WDT
Number Of I /o
32
Program Memory Size
16KB (4K x 32)
Program Memory Type
ROM
Ram Size
1K x 32
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Oscillator Type
External
Operating Temperature
0°C ~ 70°C
Package / Case
196-MAPBGA
Family Name
MCF5xxx
Device Core
ColdFire
Device Core Size
32b
Frequency (max)
66MHz
Instruction Set Architecture
RISC
Supply Voltage 1 (typ)
3.3V
Operating Temp Range
0C to 70C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
196
Package Type
MA-BGA
Cpu Speed
66MHz
Embedded Interface Type
UART, QSPI, USB, TDM
Digital Ic Case Style
BGA
No. Of Pins
196
Supply Voltage Range
3V To 3.6V
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Data Converters
-
Lead Free Status / Rohs Status
Compliant

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Signal Descriptions
19.6.4
Assertion of the transfer acknowledge (TA/PB5) input terminates an external bus cycle. It is enabled on a
per chip select basis by programming the wait state field to 0x1F in the corresponding chip select option
register (CSORn[WS]). This pin requires a 4.7-K¾ pull-up resistor or external logic that drives inactive
high.
TA must always be returned high before it can be detected again. Asserting TA into the next bus cycle has
no effect and does not terminate the bus cycle.
19.6.5
HiZ is a test signal. When it is connected to GND during reset, all output pins are driven to high impedance.
A 4.7-K¾ pullup resistor should be connected to this signal if the Hi-Z function is not used. Hi-Z
configuration input is sampled on the rising edge of Reset Output (RSTO).
19.6.6
Bypass is a Freescale test mode signal. This signal should be left unconnected.
19.6.7
RAS0 is the SDRAM row address strobe output.
19.6.8
CAS0 is the SDRAM column address strobe output.
19.6.9
The SDRAM clock output (SDCLK) is the same frequency as the CPU clock.
19.6.10 SDRAM Write Enable (SDWE)
This output is the SDRAM write enable.
19.6.11 SDRAM Clock Enable (SDCLKE)
This output is the SDRAM clock enable.
19-22
Transfer Acknowledge (TA/PB5)
Hi-Z
Bypass
SDRAM Row Address Strobe (RAS0)
SDRAM Column Address Strobe (CAS0)
SDRAM Clock (SDCLK)
Even though EBI modes set to SDRAM require setting the wait state field
in the chip select option register to 31, a low signal should never be applied
to TA during such accesses. For SDRAM accesses the bus cycle is
terminated internally by circuitry in the SDRAM module.
MCF5272 ColdFire
®
Integrated Microprocessor User’s Manual, Rev. 3
NOTE:
Freescale Semiconductor

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