MCF5272VM66 Freescale Semiconductor, MCF5272VM66 Datasheet - Page 84

• Manufacturer Part Number: MCF5272VM66
• Description: IC MPU 66MHZ COLDFIRE 196-MAPBGA
• Manufacturer: Freescale Semiconductor
• Series: MCF527xr

Specifications of MCF5272VM66

• Core Processor: Coldfire V2
• Core Size: 32-Bit
• Speed: 66MHz
• Connectivity: EBI/EMI, Ethernet, I²C, SPI, UART/USART, USB
• Peripherals: DMA, WDT
• Number Of I /o: 32
• Program Memory Size: 16KB (4K x 32)
• Program Memory Type: ROM
• Ram Size: 1K x 32
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Oscillator Type: External
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 196-MAPBGA
• Family Name: MCF5xxx
• Device Core: ColdFire
• Device Core Size: 32b
• Frequency (max): 66MHz
• Instruction Set Architecture: RISC
• Supply Voltage 1 (typ): 3.3V
• Operating Temp Range: 0C to 70C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 196
• Package Type: MA-BGA
• Cpu Speed: 66MHz
• Embedded Interface Type: UART, QSPI, USB, TDM
• Digital Ic Case Style: BGA
• No. Of Pins: 196
• Supply Voltage Range: 3V To 3.6V
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Data Converters: -
• Lead Free Status / Rohs Status: Compliant

ColdFire Core
2-16
BCHG
BCLR
BRA
BSET
BSR
BTST
CLR
CMP
CMPA
CMPI
DIVS
DIVU
EOR
EORI
EXT
EXTB
HALT
JMP
JSR
LEA
LINK
LSL
LSR
MAC
MACL
MOVE
Instruction
1
Dy,<ea>x
#<data>,<ea-1>x
Dy,<ea>x
#<data>,<ea-1>x
<label>
Dy,<ea>x
#<data>,<ea-1>x
<label>
Dy,<ea>x
#<data>,<ea-1>x
<ea>y,Dx
<ea>y,Ax
<ea>y,Dx
<ea>y,Dx
<ea-1>y,Dx
<ea>y,Dx
<ea-1>y,Dx
Dy,<ea>x
Dy,<ea>x
#<data>,Dx
#<data>,Dx
Dx
None
<ea-3>y
<ea-3>y
<ea-3>y,Ax
Ax,#<d16>
Dy,Dx
#<data>,Dx
Dy,Dx
#<data>,Dx
Ry,RxSF
Ry,RxSF,<ea-1>y,Rw
<ea>y,<ea>x
Operand Syntax
MCF5272 ColdFire
Table 2-7. User-Mode Instruction Set Summary (continued)
.B,.L
.B,.L
.B,.L
.B,.L
.B,.W
.B,.L
.B,.L
.B,.W
.B,.L
.B,.L
.B,.W,.L
.L
.L
.L
.W
.L
.W
.L
.L
.L
.B →.W
.W →.L
.B →.L
Unsized
Unsized
Unsized
.L
.W
.L
.L
.L
.L
.L + (.W × .W) → .L
.L + (.L × .L) → .L
.L + (.W × .W) → .L, .L
.L + (.L × .L) → .L, .L
.B,.W,.L
Operand Size
®
Integrated Microprocessor User’s Manual, Rev. 3
~(<bit number> of destination) → Z,
Bit of destination
~(<bit number> of destination) → Z;
0 → bit of destination
PC + 2 + d
~(<bit number> of destination) → Z;
1→ bit of destination
SP – 4 → SP; next sequential PC→ (SP); PC + 2 + d
~(<bit number> of destination) → Z
0 → destination
Destination – source
Destination – source
Destination – immediate data
Dx /<ea>y → Dx {16-bit remainder; 16-bit quotient}
Dx /<ea>y → Dx {32-bit quotient}
Signed operation
Dx /<ea>y → Dx {16-bit remainder; 16-bit quotient}
Dx /<ea>y → Dx {32-bit quotient}
Unsigned operation
Source ^ destination → destination
Immediate data ^ destination → destination
Sign-extended destination → destination
Sign-extended destination → destination
Enter halted state
Address of <ea> → PC
SP – 4 → SP; next sequential PC → (SP); <ea> → PC
<ea> → Ax
SP – 4 → SP; Ax → (SP); SP → Ax; SP + d16 → SP
X/C ← (Dx << Dy) ← 0
X/C ← (Dx << #<data>) ← 0
0 → (Dx >> Dy) → X/C
0 → (Dx >> #<data>) → X/C
ACC + (Ry × Rx){<< 1 | >> 1} → ACC
ACC + (Ry × Rx){<< 1 | >> 1} → ACC; (<ea>y{&MASK}) →
Rw
ACC + (Ry × Rx){<< 1 | >> 1} → ACC
ACC + (Ry × Rx){<< 1 | >> 1} → ACC; (<ea-1>y{&MASK}) →
Rw
<ea>y → <ea>x
n
→ PC
Operation
Freescale Semiconductor
n
→ PC