MC9S12HZ128VAL Freescale Semiconductor, MC9S12HZ128VAL Datasheet - Page 628

• Manufacturer Part Number: MC9S12HZ128VAL
• Description: IC MCU 16BIT 2K FLASH 112-LQFP
• Manufacturer: Freescale Semiconductor
• Series: HCS12r

Specifications of MC9S12HZ128VAL

• Core Processor: HCS12
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: CAN, EBI/EMI, I²C, SCI, SPI
• Peripherals: LCD, Motor control PWM, POR, PWM, WDT
• Number Of I /o: 85
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• Eeprom Size: 2K x 8
• Ram Size: 6K x 8
• Voltage - Supply (vcc/vdd): 2.35 V ~ 5.5 V
• Data Converters: A/D 16x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C
• Package / Case: 112-LQFP
• Processor Series: S12H
• Core: HCS12
• Data Bus Width: 16 bit
• Data Ram Size: 6 KB
• Interface Type: I2C/SCI/SPI
• Maximum Clock Frequency: 50 MHz
• Number Of Programmable I/os: 85
• Number Of Timers: 8
• Maximum Operating Temperature: + 105 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWHCS12
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 16-ch x 10-bit
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

1
Appendix A Electrical Characteristics
A.1.8
Power dissipation and thermal characteristics are closely related. The user must assure that the maximum
operating junction temperature is not exceeded. The average chip-junction temperature (T
obtained from:
The total power dissipation can be calculated from:
628
T J
T J
T A
P D
P D
P INT
P INT
P IO
Num C
10
The values for thermal resistance are achieved by package simulations
JA
1
2
3
4
5
6
7
8
9
P
=
=
=
=
=
IO
=
=
T Thermal Resistance LQFP112, single sided PCB
T Thermal Resistance LQFP112, double sided PCB
T Junction to Board LQFP112
T Junction to Case LQFP112
T Junction to Package Top LQFP112
T Thermal Resistance QFP 80, single sided PCB
T Thermal Resistance QFP 80, double sided PCB
T Junction to Board QFP80
T Junction to Case QFP80
T Junction to Package Top QFP80
T A
Junction Temperature, [ C
Ambient Temperature, [ C
=
=
Total Chip Power Dissipation, [W]
P INT
is the sum of all output currents on I/O ports associated with VDDX1,2 and VDDM1,2,3.
Package Thermal Resistance, [ C/W]
with 2 internal planes
i
Chip Internal Power Dissipation, [W]
I DDR V DDR
+
with 2 internal planes
Power Dissipation and Thermal Characteristics
R DSON
P D
+
P IO
JA
I IO
+
3
i
Rating
2
I DDA V DDA
Table A-5. Thermal Package Characteristics
MC9S12HZ256 Data Sheet, Rev. 2.05
2
Symbol
JA
JA
JB
JC
JA
JA
JB
JC
JT
JT
Min
—
—
—
—
—
—
—
—
–
–
1
Typ
—
—
—
—
—
—
—
—
–
–
Freescale Semiconductor
J
Max
) in C can be
54
41
31
11
51
41
27
14
2
3
o
o
o
o
o
o
o
o
o
o
Unit
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W