DF2218BR24V Renesas Electronics America, DF2218BR24V Datasheet - Page 55

IC H8S/2218 MCU FLASH 112-LFBGA

DF2218BR24V

Manufacturer Part Number
DF2218BR24V
Description
IC H8S/2218 MCU FLASH 112-LFBGA
Manufacturer
Renesas Electronics America
Series
H8® H8S/2200r
Datasheets

Specifications of DF2218BR24V

Core Processor
H8S/2000
Core Size
16-Bit
Speed
24MHz
Connectivity
SCI, SmartCard, USB
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
69
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
12K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 6x10b
Oscillator Type
External
Operating Temperature
-20°C ~ 75°C
Package / Case
112-LFBGA
For Use With
HS0005KCU11H - EMULATOR E10A-USB H8S(X),SH2(A)3DK2218-SS - KIT DEV H8S/2218 WINDOWS SIDESHW3DK2218 - DEV EVAL KIT H8S/2218
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF2218BR24V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Table 19.2
Table 19.3
Table 19.4
Section 20 Power-Down Modes
Table 20.1
Table 20.2
Table 20.3
Table 20.4
Section 22 Electrical Characteristics
Table 22.1
Table 22.2
Table 22.3
Table 22.4
Table 22.5
Table 22.6
Table 22.7
Table 22.8
Table 22.9
Table 22.10 Flash Memory Characteristics................................................................................ 683
Crystal Resonator Characteristics........................................................................... 600
External Clock Input Conditions ............................................................................ 601
External Clock Input Conditions when Duty Adjustment Circuit Is not Used....... 602
LSI Internal States in Each Mode........................................................................... 608
Transition Conditions of Power-Down Modes....................................................... 610
Oscillation Stabilization Time Settings .................................................................. 620
φ Pin State in Each Processing State ...................................................................... 627
Absolute Maximum Ratings................................................................................... 657
DC Characteristics.................................................................................................. 659
Permissible Output Currents................................................................................... 662
Clock Timing.......................................................................................................... 664
Control Signal Timing............................................................................................ 666
Bus Timing............................................................................................................. 668
Timing of On-Chip Supporting Modules ............................................................... 675
USB Characteristics (USD+ and USD- pins) when On-Chip USB Transceiver Is
Used........................................................................................................................ 680
A/D Conversion Characteristics ............................................................................. 682
Rev.7.00 Dec. 24, 2008 Page liii of liv
REJ09B0074-0700

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