JG82875 S L8DB Intel, JG82875 S L8DB Datasheet - Page 144

• Manufacturer Part Number: JG82875 S L8DB
• Manufacturer: Intel

Specifications of JG82875 S L8DB

• Mounting: Surface Mount
• Lead Free Status / RoHS Status: Compliant

Electrical Characteristics
6.3
6.4
144
Table 30. Power Characteristics
Table 31. Signal Groups
Power Characteristics
NOTES:
Signal Groups
The signal description includes the type of buffer used for the particular signal:
1. VCC, VCC_HI, and VCC_AGP current levels may happen simultaneously and can be summed into one 1.5 V
I
I
I
I
I
I
I
I
I
I
AGP Interface Signal Groups (only AGP 3.0 naming convention listed)
(a)
(b)
(c)
(d)
VCC
VCC_AGP
VCCA_AGP
VCC_HI
VTT
VCC_DDR
VCCA_DDR
VCC_33
VCCA_FSB
VCC_SUS_2.6
Signal
Group
supply.
Symbol
AGTL+
AGP
HI15
SSTL_2
Miscellaneous 2.6 V and 3.3 V miscellaneous buffers.
AGP I/O
AGP Input
AGP Output
AGP Miscellaneous
1.5 V Core Supply Current
1.5 V AGP Supply Current
1.5 V Analog AGP Supply Current
1.5 V HI/CSA Supply Current
VTT Supply Current
2.6 V DDR System Memory Interface Supply Current
1.5 V Analog Supply Current for System Memory DLLs
3.3 V Supply Current
1.5 V Host PLL Analog Supply Current
2.6 V Standby Supply Current
Signal Type
Open Drain AGTL+ interface signal. Refer to the AGTL+ I/O Specification
for complete details. The MCH integrates most AGTL+ termination resistors.
AGP interface signals. These signals are compatible with AGP 2.0 1.5 V and
AGP 3.0 0.8 V Signaling Environment DC and AC Specifications. The buff-
ers are not 3.3 V tolerant.
Hub Interface and CSA 1.5 V CMOS buffers.
Stub Series Terminated Logic 2.6 V compatible signals. DDR system mem-
ory 2.6 V CMOS buffers.
GADSTBF[1:0], GADSTBS[1:0], GFRAME, GIRDY, GTRDY,
GSTOP, GDEVSEL, GAD[31:0], GCBE[3:0], GPAR, DBI_HI,
DBI_LO
GSBA[7:0]#, GRBF, GWBF, GSBSTBF, GSBSTBS, GREQ
GST[2:0], GGNT
GVREF, GRCOMP, GVSWING
Parameter
Signals
Intel
0.250
Max
0.37
0.01
0.18
6.27
0.05
2.7
1.6
1.2
0.2
®
82875P MCH Datasheet
Unit
A
A
A
A
A
A
A
A
A
A
Notes
Notes
1
1
1
1