PM8611-BIAP PMC [PMC-Sierra, Inc], PM8611-BIAP Datasheet - Page 290

• Manufacturer Part Number: PM8611-BIAP
• Manufacturer: PMC [PMC-Sierra, Inc]

19.1
19.2
19
Proprietary and Confidential to PMC-Sierra, Inc., and for its Customers’ Internal Use
Document ID: PMC-2010883, Issue 2
Ordering and Thermal Information
Ordering Information
Thermal Information
The SBSLITE is designed to operate over a wide temperature range and is suited for
industrial applications such as outside plant equipment.
Notes
1.
2.
3.
Part No.
PM8611-BIAP
Maximum long-term operating junction temperature To ensure adequate long-term life.
Maximum junction temperature for short-term excursions with guaranteed continued
functional performance.
reaches 85 ºC.
Minimum ambient temperature
Thermal Resistance vs Air Flow
Airflow
Device Compact Model
Operating power is dissipated in package (watts) at
worst case power supply
Power (watts)
JA
JT
JB
Short-term is understood as the definition stated in Telcordia Generic Requirements GR-63-Core.
JESD51 (2S2P)
resistance are obtained by simulating conditions described in JEDEC Standard, JESD 15-8.
(
(
(
0
0
0
JA
JB
C/W)
C/W)
C/W)
, the junction-to-board thermal resistance and
, the total junction to ambient thermal resistance as measured according to JEDEC Standard
3
1
This condition will typically be reached when local ambient
1.36
2
Description
160 Plastic Ball Grid Array (PBGA)
5.9
18.8
27.9
Natural Convection
SBSLITE™ Telecom Standard Product Data Sheet
JT,
the residual junction to ambient thermal
Ambient
Board
Junction
JB
200 LFM
22.6
JT
Compact
Device
Model
105 ºC
125 ºC
-40 ºC
400 LFM
20.7
Preliminary
289