MT29F128G08WAAC6 Micron, MT29F128G08WAAC6 Datasheet - Page 112

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MT29F128G08WAAC6

Manufacturer Part Number
MT29F128G08WAAC6
Description
NAND Flash Memory
Manufacturer
Micron
Datasheet
52-Pad VLGA (C4)
Figure 95:
PDF: 09005aef8278ee3f / Source: 09005aef81f17540
16gb_nand_mlc_l52a__2.fm -Rev. D 5/08 EN
13.00
Pads Ø 0.70
Non solder mask defined.
Pads Ø 1.00
Non solder mask defined.
Seating
12.00
plane
12X Ø1.00 ±0.05
40X Ø0.70 ±0.05
10.00
5.00
6.00
52-Pad VLGA (C4 Package Code
0.10 A
PAD A6
2.00
TYP
Notes: 1. All dimensions are in millimeters.
A
1
1
)
2. Pads are plated with 5-16 microns of nickel followed by a minimum of 0.50 microns of soft
3. All dimensions are in millimeters.
6.00 ±0.05
wire bondable gold (99.9% pure).
12.00 ±0.10
2.00
10.00
4.00
6.00
C
L
Micron Confidential and Proprietary
3.00
2.00
TYP
5.00
112
Pad A1
C
L
7.80
2.00
TYP
Ø0.70 PAD A1 ID
www.DataSheet.net/
8.50 ±0.05
6.50
16, 32, 64, 128Gb NAND Flash Memory
Micron Technology, Inc., reserves the right to change products or specifications without notice.
17.00 ±0.10
1.00 MAX
Substrate material: Plastic laminate
Mold compound: Epoxy novolac
Package Information
©2005 Micron Technology, Inc. All rights reserved.
Pad A1 ID
Datasheet pdf - http://www.DataSheet4U.co.kr/

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