pc87591l National Semiconductor Corporation, pc87591l Datasheet - Page 382

• Manufacturer Part Number: pc87591l
• Description: Lpc Mobile Embedded Controllers
• Manufacturer: National Semiconductor Corporation

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7.0 Device Specifications
7.6
7.6.1
Notes:
1. V
2. C
3. S
The following abbreviations are used in Section 7.6:
RE = Rising Edge
FE = Falling Edge
Definitions
The timing specifications in this section refer to low- or high-level voltage, according to the specific buffer type (TTL or
CMOS) on the rising or falling edges of all the signals, as illustrated in the following figures, unless specifically stated other-
wise.
Load Circuit
Input
S
S
R
SUP
1
1
1
L
L
= Open for push-pull output pins.
= V
= V
= 50 pF for all output pins (this value includes both jig and oscilloscope capacitance).
= 1.0 K
AC ELECTRICAL CHARACTERISTICS
AC Test Conditions
is V
SUP
SS
DD
for high impedance to active high and active high to high impedance measurements.
for high impedance to active low and active low to high impedance measurements.
0.1 f
, V
(Notes 1, 2, 3)
CC
, AV
Figure 124. AC Test Conditions, T
Device
CC
Under
V
Test
Figure 125. CMOS Output Signals Specification Conventions
SUP
or V
CLK
SIG1
SIG2
BAT
, according to the power well of the pin.
(Continued)
R
L
S
1
t
SIG2v
t
SIG1v
2.0V
C
t
t
SIG2h
SIG1h
L
t
SIG2a
t
Output
SIG1a
or t
or t
SIG2ia
SIG1ia
382
A
= 0 C to 70 C, V
Vcc
Vcc
Vcc
Vcc
2.4
0.4
AC Testing Input, Output Waveform
*
*
*
*
0.3
0.7
0.7
0.3
2.0
0.8
SUP
= 3.3V 10%
2.40V
V
V
V
V
OH
OL
OH
OL
Test Points
, V
, V
, V
, V
OHhd
OLhd
OLhd
OHhd
2.0
0.8
Revision 1.07