DF2166VT33WV Renesas Electronics America, DF2166VT33WV Datasheet - Page 42
![MCU 16BIT FLASH 3V 512K 144-TQFP](/photos/28/61/286114/144-tqfp_sml.jpg)
DF2166VT33WV
Manufacturer Part Number
DF2166VT33WV
Description
MCU 16BIT FLASH 3V 512K 144-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2100r
Datasheet
1.HS2168EPI61H-U.pdf
(876 pages)
Specifications of DF2166VT33WV
Core Processor
H8S/2000
Core Size
16-Bit
Speed
33MHz
Connectivity
I²C, IrDA, LPC, SCI, SmartCard
Peripherals
POR, PWM, WDT
Number Of I /o
106
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
40K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
External
Operating Temperature
-20°C ~ 75°C
Package / Case
144-TQFP, 144-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DF2166VT33WV
Manufacturer:
Renesas Electronics America
Quantity:
135
Company:
Part Number:
DF2166VT33WV
Manufacturer:
Renesas Electronics America
Quantity:
10 000
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Section 23 Power-Down Modes
Table 23.1
Table 23.2
Section 25 Electrical Characteristics
Table 25.1
Table 25.2
Table 25.2
Table 25.3
Table 25.4
Table 25.5
Table 25.6
Table 25.7
Table 25.8
Table 25.9
Table 25.10
Table 25.11
Table 25.12
Table 25.13
Table 25.14
Table 25.15
Table 25.16
Rev. 3.00, 03/04, page xl of xl
Operating Frequency and Wait Time.................................................................... 730
LSI Internal States in Each Mode ......................................................................... 737
Absolute Maximum Ratings ................................................................................. 783
DC Characteristics (1) .......................................................................................... 784
DC Characteristics (2) .......................................................................................... 785
Permissible Output Currents................................................................................. 787
Clock Timing ........................................................................................................ 788
External Clock Input Conditions .......................................................................... 789
Subclock Input Conditions.................................................................................... 789
Control Signal Timing .......................................................................................... 792
Bus Timing ........................................................................................................... 794
Multiplex Bus Timing........................................................................................... 800
Timing of On-Chip Peripheral Modules ........................................................... 803
I
LPC Module Timing......................................................................................... 808
JTAG Timing.................................................................................................... 809
A/D Conversion Characteristics
D/A Conversion Characteristics ....................................................................... 812
Flash Memory Characteristics .......................................................................... 813
(AN7 to AN0 Input: 134/266-State Conversion).............................................. 811
2
C Bus Timing ................................................................................................. 807
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