DF2166VT33WV Renesas Electronics America, DF2166VT33WV Datasheet - Page 737
![MCU 16BIT FLASH 3V 512K 144-TQFP](/photos/28/61/286114/144-tqfp_sml.jpg)
DF2166VT33WV
Manufacturer Part Number
DF2166VT33WV
Description
MCU 16BIT FLASH 3V 512K 144-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2100r
Datasheet
1.HS2168EPI61H-U.pdf
(876 pages)
Specifications of DF2166VT33WV
Core Processor
H8S/2000
Core Size
16-Bit
Speed
33MHz
Connectivity
I²C, IrDA, LPC, SCI, SmartCard
Peripherals
POR, PWM, WDT
Number Of I /o
106
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
40K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
External
Operating Temperature
-20°C ~ 75°C
Package / Case
144-TQFP, 144-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
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DF2166VT33WV
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DF2166VT33WV
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20.9
1. The initial state of the product at its shipment is in the erased state. For the product whose
2. For the PROM programmer suitable for programmer mode in this LSI and its program version,
3. If the socket, socket adapter, or product index does not match the specifications, too much
4. If a voltage higher than the rated voltage is applied, the product may be fatally damaged. Use a
5. Do not remove the chip from the PROM programmer nor input a reset signal during
6. The flash memory is not accessible until FKEY is cleared after programming/erasing
7. At powering on or off the Vcc power supply, fix the RES pin to low and set the flash memory
8. Program the area with 128-byte programming-unit blocks in on-board programming or
9. When the chip is to be reprogrammed with the programmer after execution of programming or
10. To write data or programs to the flash memory, data or programs must be allocated to
11. If data other than H'FFFFFFFF is written to the key code area (H'00003C to H'00003F) of
revision of erasing is undefined, we recommend to execute automatic erasure for checking the
initial state (erased state) and compensating.
refer to the instruction manual of the socket adapter.
current flows and the product may be damaged.
PROM programmer that supports the 256 or 512-kbyte flash memory on-chip MCU device at
3.3 V. Do not set the programmer to HN28F101 or the programming voltage to 5.0 V. Use
only the specified socket adapter. If other adapters are used, the product may be damaged.
programming/erasing. As a high voltage is applied to the flash memory during
programming/erasing, doing so may damage or destroy flash memory permanently. If reset is
executed accidentally, reset must be released after the reset input period of 100 µs which is
longer than normal.
completes. If this LSI is restarted by a reset immediately after programming/erasing has
finished, secure the reset period (period of RES = 0) of more than 100 µs. Though transition to
the reset state or hardware standby state during programming/erasing is prohibited, if reset is
executed accidentally, reset must be released after the reset input period of 100 µs which is
longer than normal.
to hardware protection state. This power on/off timing must also be satisfied at a power-off and
power-on caused by a power failure and other factors.
programmer mode only once. Perform programming in the state where the programming-unit
block is fully erased.
erasure in on-board programming mode, it is recommend that automatic programming is
performed after execution of automatic erasure.
addresses higher than that of the external interrupt vector table (H'000040) and H'FF must be
written to the areas that are reserved for the system in the exception handling vector table.
flash memory, only H'00 can be read in programmer mode. (In this case, data is read as H'00.
Rewrite is possible after erasing the data.) For reading in programmer mode, make sure to
write H'FFFFFFFF to the entire key code area. If data other than H'FF is to be written to the
Usage Notes
Rev. 3.00, 03/04, page 695 of 830
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