DF2166VT33WV Renesas Electronics America, DF2166VT33WV Datasheet - Page 475
DF2166VT33WV
Manufacturer Part Number
DF2166VT33WV
Description
MCU 16BIT FLASH 3V 512K 144-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2100r
Datasheet
1.HS2168EPI61H-U.pdf
(876 pages)
Specifications of DF2166VT33WV
Core Processor
H8S/2000
Core Size
16-Bit
Speed
33MHz
Connectivity
I²C, IrDA, LPC, SCI, SmartCard
Peripherals
POR, PWM, WDT
Number Of I /o
106
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
40K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
External
Operating Temperature
-20°C ~ 75°C
Package / Case
144-TQFP, 144-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DF2166VT33WV
Manufacturer:
Renesas Electronics America
Quantity:
135
Company:
Part Number:
DF2166VT33WV
Manufacturer:
Renesas Electronics America
Quantity:
10 000
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14.11.4 Note on CRC Operation Circuit
Note that the sequence to transmit the CRC code differs between LSB-first transmission and
MSB-first transmission.
1. CRC code generation
2. Transmission data
After specifying the operation method, write data to CRCDIR in the sequence of (1) → (2) → (3) → (4).
(i) LSB-first transmission
(ii) MSB-first transmission
Output
CRCDIR
CRCDORH
CRCDORL
Figure 14.50 LSB-First and MSB-First Transmit Data
7
7
7
7
(1) → (2) → (3) → (4)
(5)
(1)
CRC code
0
0
7
7
(5)
(6)
(6)
(2)
CRC code generation
0
0
7
7
(3)
(4)
0
0
0
0
7
7
(4)
(3)
0
0
7
7
Rev. 3.00, 03/04, page 433 of 830
(2)
(5)
CRC code
0
0
7
7
(1)
(6)
0
0
Output
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