DF2166VT33WV Renesas Electronics America, DF2166VT33WV Datasheet - Page 851
DF2166VT33WV
Manufacturer Part Number
DF2166VT33WV
Description
MCU 16BIT FLASH 3V 512K 144-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2100r
Datasheet
1.HS2168EPI61H-U.pdf
(876 pages)
Specifications of DF2166VT33WV
Core Processor
H8S/2000
Core Size
16-Bit
Speed
33MHz
Connectivity
I²C, IrDA, LPC, SCI, SmartCard
Peripherals
POR, PWM, WDT
Number Of I /o
106
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
40K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
External
Operating Temperature
-20°C ~ 75°C
Package / Case
144-TQFP, 144-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DF2166VT33WV
Manufacturer:
Renesas Electronics America
Quantity:
135
Company:
Part Number:
DF2166VT33WV
Manufacturer:
Renesas Electronics America
Quantity:
10 000
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Table 25.13 JTAG Timing
Condition: VCC = 3.0 V to 3.6 V, VSS = 0 V, φ = 5 MHz to 33 MHz
Note:
Item
ETCK clock cycle time
ETCK clock high pulse width
ETCK clock low pulse width
ETCK clock rise time
ETCK clock fall time
ETRST pulse width
Reset hold transition pulse width
ETMS setup time
ETMS hold time
ETDI setup time
ETDI hold time
ETDO data delay time
*
LAD3 to LAD0,
SERIRQ, CLKRUN
(Transmit signal)
LAD3 to LAD0,
SERIRQ, CLKRUN,
LFRAME
(Receive signal)
LAD3 to LAD0,
SERIRQ, CLKRUN
(Transmit signal)
When t
LCLK
LCLK
cyc
≤ t
TCKcyc
Figure 25.31 LPC Interface (LPC) Timing
Symbol Min.
t
t
t
t
t
t
t
t
t
t
t
t
TCKcyc
TCKH
TCKL
TCKr
TCKf
TRSTW
RSTHW
TMSS
TMSH
TDIS
TDIH
TDOD
t
t
TXD
OFF
40*
15
15
20
3
20
20
20
20
t
LCKH
t
RXS
t
LCKL
Max.
200*
5
5
20
t
Lcyc
t
RXH
Rev. 3.00, 03/04, page 809 of 830
Unit
ns
t
ns
cyc
Test Conditions
Figure 25.32
Figure 25.33
Figure 25.34
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