DF2166VT33WV Renesas Electronics America, DF2166VT33WV Datasheet - Page 454
![MCU 16BIT FLASH 3V 512K 144-TQFP](/photos/28/61/286114/144-tqfp_sml.jpg)
DF2166VT33WV
Manufacturer Part Number
DF2166VT33WV
Description
MCU 16BIT FLASH 3V 512K 144-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2100r
Datasheet
1.HS2168EPI61H-U.pdf
(876 pages)
Specifications of DF2166VT33WV
Core Processor
H8S/2000
Core Size
16-Bit
Speed
33MHz
Connectivity
I²C, IrDA, LPC, SCI, SmartCard
Peripherals
POR, PWM, WDT
Number Of I /o
106
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
40K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
External
Operating Temperature
-20°C ~ 75°C
Package / Case
144-TQFP, 144-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DF2166VT33WV
Manufacturer:
Renesas Electronics America
Quantity:
135
Company:
Part Number:
DF2166VT33WV
Manufacturer:
Renesas Electronics America
Quantity:
10 000
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TDRE
TEND
FER/ERS
Note that the TEND flag is set in different timings depending on the GM bit setting in SMR,
which is shown in figure 14.30.
Rev. 3.00, 03/04, page 412 of 830
I/O data
TXI
(TEND interrupt)
Ds
[Legend]
Ds:
D0 to D7:
Dp:
DE:
etu:
Transfer from TDR to TSR
GM = 0
GM = 1
Figure 14.29 Data Re-transfer Operation in SCI Transmission Mode
D0 D1 D2 D3 D4 D5 D6 D7 Dp DE
Figure 14.30 TEND Flag Set Timings during Transmission
Start bit
Data bits
Parity bit
Error signal
Element Time Unit (time taken to transfer one bit)
nth transfer frame
Ds
D0
D1
[1]
D2
[2]
Ds D0 D1 D2 D3 D4 D5 D6 D7 Dp
D3
Transfer from TDR to TSR
11.0 etu
12.5 etu
D4
Retransfer frame
D5
D6
D7
Dp
(DE)
[3]
[3]
Guard time
DE
Ds D0 D1 D2 D3 D4
Transfer from TDR to TSR
transfer frame
(n + 1) th
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