pc87591l-n05 National Semiconductor Corporation, pc87591l-n05 Datasheet - Page 343

• Manufacturer Part Number: pc87591l-n05
• Description: Lpc Mobile Embedded Controller
• Manufacturer: National Semiconductor Corporation

Revision 1.2
7.0 Device Specifications
7.6
7.6.1
Notes:
1. V
2. C
3. S
The following abbreviations are used in Section 7.6:
RE = Rising Edge
FE = Falling Edge
Definitions
The timing specifications in this section refer to low- or high-level voltage, according to the specific buffer type (TTL or
CMOS) on the rising or falling edges of all the signals, as shown in the following figures, unless specifically stated otherwise.
Load Circuit
Input
S
S
R
SUP
1
1
1
L
L
= Open for push-pull output pins.
= V
= V
= 1.0 K
= 50 pF for all output pins except the following pin groups (these values include both jig and oscilloscope capaci-
AC ELECTRICAL CHARACTERISTICS
AC Test Conditions
tance):
C
is V
SUP
SS
L
= 400 pF for ACCESS.bus pins.
DD
for high impedance to active high and active high to high impedance measurements.
for high impedance to active low and active low to high impedance measurements.
0.1 f
, V
(Notes 1, 2, 3)
CC
, AV
Figure 116. AC Test Conditions, T
Device
CC
Under
V
Test
Figure 117. CMOS Output Signals Specification Conventions
SUP
or V
CLK
SIG1
SIG2
BAT
, according to the power well of the pin.
(Continued)
R
L
S
1
t
SIG2v
t
SIG1v
2.0V
C
t
t
SIG2h
SIG1h
L
t
SIG2a
t
Output
SIG1a
or t
or t
SIG2ia
SIG1ia
343
A
= 0 C to 70 C, V
V
V
V
V
2.4
0.4
CC *
AC Testing Input, Output Waveform
CC *
CC *
CC *
0.3
0.7
0.7
0.3
2.0
0.8
SUP
= 3.3V 10%
2.40V
V
V
V
V
OH
OL
OH
OL
Test Points
, V
, V
, V
, V
OHhd
OLhd
OLhd
OHhd
2.0
0.8
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