DF2328BVF25V Renesas Electronics America, DF2328BVF25V Datasheet - Page 1005

IC H8S MCU FLASH 256K 128QFP

DF2328BVF25V

Manufacturer Part Number
DF2328BVF25V
Description
IC H8S MCU FLASH 256K 128QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheets

Specifications of DF2328BVF25V

Core Processor
H8S/2000
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
87
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
128-QFP
For Use With
EDK2329 - DEV EVALUATION KIT H8S/2329
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Other names
HD64F2328BVF25V

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF2328BVF25V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Item
CAS setup time
WAIT setup time
WAIT hold time
BREQ setup time
BACK delay time
Bus floating time
BREQO delay time
(4) DMAC Timing
Table 22.18 DMAC Timing
Condition B: V
Item
DREQ setup time
DREQ hold time
TEND delay time
DACK delay time 1
DACK delay time 2
0 V, φ = 2 MHz to 25 MHz, T
T
a
CC
= –40°C to 85°C (wide-range specifications)
= 3.0 V to 3.6 V, AV
Symbol
t
t
t
t
t
DRQS
DRQH
TED
DACD1
DACD2
Symbol
t
t
t
t
t
t
t
WTS
WTH
CSR
BRQS
BACD
BZD
BRQOD
CC
Min
0.5 × t
25
5
30
Min
25
10
= 3.0 V to 3.6 V, V
a
Condition B
= –20°C to 75°C (regular specifications),
cyc
– 8
Condition B
Max
18
18
18
Rev.6.00 Sep. 27, 2007 Page 973 of 1268
Max
15
40
25
Section 22 Electrical Characteristics
ref
Unit
ns
ns
= 2.7 V to AV
Unit
ns
ns
ns
ns
ns
ns
ns
Test Conditions
Figure 22.19
Figure 22.18
Figures 22.16 and 22.17
Test Conditions
Figure 22.10
Figure 22.8
Figure 22.14
Figure 22.15
CC
REJ09B0220-0600
, V
SS
= AV
SS
=

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