DF2328BVF25V Renesas Electronics America, DF2328BVF25V Datasheet - Page 237

IC H8S MCU FLASH 256K 128QFP

DF2328BVF25V

Manufacturer Part Number
DF2328BVF25V
Description
IC H8S MCU FLASH 256K 128QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheets

Specifications of DF2328BVF25V

Core Processor
H8S/2000
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
87
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
128-QFP
For Use With
EDK2329 - DEV EVALUATION KIT H8S/2329
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Other names
HD64F2328BVF25V

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF2328BVF25V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Relationship between Chip Select (CS) Signal and Read (RD) Signal: Depending on the
system’s load conditions, the RD signal may lag behind the CS signal. An example is shown in
figure 6.33.
In this case, with the setting for no idle cycle insertion (a), there may be a period of overlap
between the bus cycle A RD signal and the bus cycle B CS signal.
Setting idle cycle insertion, as in (b), however, will prevent any overlap between the RD and CS
signals.
In the initial state after reset release, idle cycle insertion (b) is set.
Address bus
CS (area A)
CS (area B)
RD
Possibility of overlap between
CS (area B) and RD
φ
Figure 6.33 Relationship between Chip Select (CS) and Read (RD)
(a) Idle cycle not inserted
T
1
Bus cycle A
(ICIS1 = 0)
T
2
T
3
Bus cycle B
T
1
T
2
Address bus
CS (area A)
CS (area B)
Rev.6.00 Sep. 27, 2007 Page 205 of 1268
RD
φ
T
1
Bus cycle A
(b) Idle cycle inserted
T
(ICIS1 = 1 (initial value))
2
Section 6 Bus Controller
T
3
REJ09B0220-0600
T
I
Bus cycle B
T
1
T
2

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