DF2328BVF25V Renesas Electronics America, DF2328BVF25V Datasheet - Page 218

IC H8S MCU FLASH 256K 128QFP

DF2328BVF25V

Manufacturer Part Number
DF2328BVF25V
Description
IC H8S MCU FLASH 256K 128QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheets

Specifications of DF2328BVF25V

Core Processor
H8S/2000
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
87
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
128-QFP
For Use With
EDK2329 - DEV EVALUATION KIT H8S/2329
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Other names
HD64F2328BVF25V

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF2328BVF25V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Section 6 Bus Controller
6.5.6
Figure 6.15 shows the basic access timing for DRAM space. The basic DRAM access timing is 4
states. Unlike the basic bus interface, the corresponding bits in ASTCR control only enabling or
disabling of wait insertion, and do not affect the number of access states. When the corresponding
bit in ASTCR is cleared to 0, wait states cannot be inserted in the DRAM access cycle.
The 4 states of the basic timing consist of one T
output cycle), and two T
Rev.6.00 Sep. 27, 2007 Page 186 of 1268
REJ09B0220-0600
Note: n = 2 to 5
Read
Write
Basic Timing
CAS, LCAS
CSn (RAS)
HWR (WE)
HWR (WE)
D
D
A
15
15
23
to D
to D
to A
c
φ
0
0
0
(column address output cycle) states, T
Figure 6.15 Basic Access Timing
T
p
p
(precharge cycle) state, one T
Row
T
r
T
c1
c1
and T
Column
c2
.
T
r
c2
(row address

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