DF2328BVF25V Renesas Electronics America, DF2328BVF25V Datasheet - Page 883

IC H8S MCU FLASH 256K 128QFP

DF2328BVF25V

Manufacturer Part Number
DF2328BVF25V
Description
IC H8S MCU FLASH 256K 128QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheets

Specifications of DF2328BVF25V

Core Processor
H8S/2000
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
87
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
128-QFP
For Use With
EDK2329 - DEV EVALUATION KIT H8S/2329
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Other names
HD64F2328BVF25V

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF2328BVF25V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
19.22.3 Flash Memory Operating Modes
Mode Transitions: When the mode pins and the FWE pin are set in the reset state and a reset-
start is executed, the chip enters one of the operating modes shown in figure 19.60. In user mode,
flash memory can be read but not programmed or erased.
Flash memory can be programmed and erased in boot mode, user program mode, and PROM
mode.
Notes: Only make a transition between user mode and user program mode when the CPU is
FWE = 1,
SWE = 1
(on-chip ROM
User mode
enabled)
not accessing the flash memory.
* MD0 = 0, MD1 = 0, MD2 = 0, P66 = 1, P65 = 0, P64 = 0
On-board programming mode
program mode
FWE = 0
or SWE = 0
User
Figure 19.60 Flash Memory Mode Transitions
MD1 = 1,
MD2 = 1,
FWE = 0
RES = 0
RES = 0
FWE = 1,
MD1 = 1,
MD2 = 0
Reset state
Boot mode
Rev.6.00 Sep. 27, 2007 Page 851 of 1268
RES = 0
*
RES = 0
REJ09B0220-0600
PROM mode
Section 19 ROM

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