DF2328BVF25V Renesas Electronics America, DF2328BVF25V Datasheet - Page 693

IC H8S MCU FLASH 256K 128QFP

DF2328BVF25V

Manufacturer Part Number
DF2328BVF25V
Description
IC H8S MCU FLASH 256K 128QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheets

Specifications of DF2328BVF25V

Core Processor
H8S/2000
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
87
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
128-QFP
For Use With
EDK2329 - DEV EVALUATION KIT H8S/2329
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Other names
HD64F2328BVF25V

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF2328BVF25V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Restrictions on Use of DMAC * or DTC
• When an external clock source is used as the serial clock, the transmit clock should not be
• When RDR is read by the DMAC * or DTC, be sure to set the activation source to the relevant
Note: * The DMAC is not supported in the H8S/2321.
input until at least 5 φ clock cycles after TDR is updated by the DMAC * or DTC.
Misoperation may occur if the transmit clock is input within 4 φ clocks after TDR is updated.
(Figure 14.22)
SCI receive-data-full interrupt (RXI).
SCK
TDRE
Serial data
Note: When operating on an external clock, set t > 4 clocks.
Figure 14.22 Example of Synchronous Transmission Using DTC
t
LSB
D0
D1
D2
Section 14 Serial Communication Interface (SCI)
D3
Rev.6.00 Sep. 27, 2007 Page 661 of 1268
D4
D5
D6
REJ09B0220-0600
D7

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