HD6473937RXV Renesas Electronics America, HD6473937RXV Datasheet - Page 101

• Manufacturer Part Number: HD6473937RXV
• Description: MCU 3/5V 60K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300L SLPr

Specifications of HD6473937RXV

• Core Processor: H8/300L
• Core Size: 8-Bit
• Speed: 10MHz
• Connectivity: SCI
• Peripherals: POR, WDT
• Number Of I /o: 59
• Program Memory Size: 60KB (60K x 8)
• Program Memory Type: OTP
• Ram Size: 2K x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

2. Connecting a ceramic oscillator
Figure 4-4 shows a typical method of connecting a ceramic oscillator.
3. Notes on board design
When generating clock pulses by connecting a crystal or ceramic oscillator, pay careful attention
to the following points.
Avoid running signal lines close to the oscillator circuit, since the oscillator may be adversely
affected by induction currents. (See figure 4-5.)
The board should be designed so that the oscillator and load capacitors are located as close as
possible to pins OSC
OSC
OSC
1
2
To be avoided
R
f
Figure 4-4 Typical Connection to Ceramic Oscillator
1
and OSC
C
C
Figure 4-5 Board Design of Oscillator Circuit
1
2
C
C
1
2
2
.
Oscillation
frequency
4.0 MHz
R = 1 M
f
Signal A Signal B
Manufacturer
Murata Seisakusho
20%
OSC
OSC
1
2
Recommended value
for C
30 pF 10%
1
and C
2
87