HD6473937RXV Renesas Electronics America, HD6473937RXV Datasheet - Page 68

MCU 3/5V 60K 100-TQFP

HD6473937RXV

Manufacturer Part Number
HD6473937RXV
Description
MCU 3/5V 60K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300L SLPr
Datasheet

Specifications of HD6473937RXV

Core Processor
H8/300L
Core Size
8-Bit
Speed
10MHz
Connectivity
SCI
Peripherals
POR, WDT
Number Of I /o
59
Program Memory Size
60KB (60K x 8)
Program Memory Type
OTP
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 3.6 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HD6473937RXV
Manufacturer:
Renesas Electronics America
Quantity:
10 000
To avoid this problem, store a copy of the PDR3 data in a work area in memory. Perform the bit
manipulation on the data in the work area, then write this data to PDR3.
[A: Prior to executing BSET]
MOV. B
MOV. B
MOV. B
Input/output
Pin state
PCR3
PDR3
RAM0
[B: BSET instruction executed]
BSET
MOV. B
MOV. B
Input/output
Pin state
PCR3
PDR3
RAM0
54
[C: After executing BSET]
#80
R0L
R0L
#0
@RAM0,
R0L,
P3
Input
Low
level
0
1
1
P3
Input
Low
level
0
1
1
,
,
,
,
7
7
R0L
@RAM0
@PDR3
@RAM0
@PDR3
R0L
P3
Input
High
level
0
0
0
P3
Input
High
level
0
0
0
6
6
P3
Output
Low
level
1
0
0
P3
Output
Low
level
1
0
0
The PDR3 value (H'80) is written to a work area in
memory (RAM0) as well as to PDR3.
The BSET instruction is executed designating the PDR3
work area (RAM0).
The work area (RAM0) value is written to PDR3.
5
5
P3
Output
Low
level
1
0
0
P3
Output
Low
level
1
0
0
4
4
P3
Output
Low
level
1
0
0
P3
Output
Low
level
1
0
0
3
3
P3
Output
Low
level
1
0
0
P3
Output
Low
level
1
0
0
2
2
P3
Output
Low
level
1
0
0
P3
Output
Low
level
1
0
0
1
1
P3
Output
Low
level
1
0
0
P3
Output
High
level
1
1
1
0
0

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