HD6473937RXV Renesas Electronics America, HD6473937RXV Datasheet - Page 256

MCU 3/5V 60K 100-TQFP

HD6473937RXV

Manufacturer Part Number
HD6473937RXV
Description
MCU 3/5V 60K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300L SLPr
Datasheet

Specifications of HD6473937RXV

Core Processor
H8/300L
Core Size
8-Bit
Speed
10MHz
Connectivity
SCI
Peripherals
POR, WDT
Number Of I /o
59
Program Memory Size
60KB (60K x 8)
Program Memory Type
OTP
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 3.6 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HD6473937RXV
Manufacturer:
Renesas Electronics America
Quantity:
10 000
10.2
10.2.1
Serial communication interface 1 (SCI1) can carry out 8-bit or 16-bit serial data transfer in
synchronous mode. SCI1 is an internal function that performs interfacing to the FLEX™ decoder
incorporated in the chip. It cannot be connected to an IC outside the chip for data communication
use.
1. Features
Features of SCI1 are listed below.
242
Choice of 8-bit or 16-bit transfer data length
Choice of 8 internal clocks (ø/1024, ø/256, ø/64, ø/32, ø/16, ø/8, ø/4, or ø
Interrupt request generated on completion of transfer
SCI1 [Chip Internal Function]
Overview
W
/4) as clock source

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