EP3SE50F780I3N Altera, EP3SE50F780I3N Datasheet - Page 440

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EP3SE50F780I3N

Manufacturer Part Number
EP3SE50F780I3N
Description
Stratix III
Manufacturer
Altera
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IEEE Std. 1149.1 BST Architecture
IEEE Std. 1149.1
BST Architecture
13–2
Stratix III Device Handbook, Volume 1
TDI
TDO
Table 13–1. IEEE Std. 1149.1 Pin Descriptions (Part 1 of 2)
Pin
f
Test data input
Test data output
Description
This chapter discusses how to use the IEEE Std. 1149.1 BST circuitry in
Stratix
In addition to BST, you can use the IEEE Std. 1149.1 controller for
Stratix III device in-circuit reconfiguration (ICR). However, this chapter
only discusses the BST feature of the IEEE Std. 1149.1 circuitry.
For information on configuring Stratix III devices via the IEEE Std.
1149.1 circuitry, refer to the
and Power-On Reset in Stratix III
with Stratix III Devices
Handbook.
A Stratix III device operating in IEEE Std. 1149.1 BST mode uses four
required pins, TDI, TDO, TMS, and TCK, and one optional pin, TRST. The
TCK pin has an internal weak pull-down resistor, while the TDI, TMS,
and TRST pins have weak internal pull-ups. The TDO output pin and all
the JTAG input pins are powered by the 2.5-V/3.0-V V
Bank 1A. All user I/O pins are tri-stated during JTAG configuration.
1
Table 13–1
“IEEE Std. 1149.1 BST Architecture”
“IEEE Std. 1149.1 Boundary-Scan Register”
“IEEE Std. 1149.1 BST Operation Control”
“I/O Voltage Support in JTAG Chain”
“IEEE Std. 1149.1 BST Circuitry”
“IEEE Std. 1149.1 BST for Configured Devices”
“IEEE Std. 1149.1 BST Circuitry (Disabling)”
“IEEE Std. 1149.1 BST Guidelines”
“Boundary-Scan Description Language (BSDL) Support”
®
III devices, including:
For recommendations on how to connect a JTAG chain with
multiple voltages across the devices in the chain, refer to
Voltage Support in JTAG Chain” on page
Serial input pin for instructions as well as test and programming data.
Signal applied to
of
Serial data output pin for instructions as well as test and programming
data. Data is shifted out on the falling edge of
if data is not being shifted out of the device.
summarizes the functions of each of these pins.
TCK
. Data is shifted in on the rising edge of
chapters in volume 1 of the Stratix III Device
TDI
Configuring Stratix III
is expected to change state at the falling edge
Devices, and the
Function
Remote System Upgrades
Devices,
TCK
13–18.
TCK
CCPD
. The pin is tri-stated
Altera Corporation
.
Hot Socketing
November 2007
supply of I/O
“I/O

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