ORSPI4-2FTE1036I Lattice, ORSPI4-2FTE1036I Datasheet - Page 151

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ORSPI4-2FTE1036I

Manufacturer Part Number
ORSPI4-2FTE1036I
Description
FPGA - Field Programmable Gate Array ORCA FPSC 1.5V SPI4 Interface
Manufacturer
Lattice
Datasheet

Specifications of ORSPI4-2FTE1036I

Product Category
FPGA - Field Programmable Gate Array
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
Package / Case
FPTBGA-1036
Minimum Operating Temperature
- 40 C
Factory Pack Quantity
60
Lattice Semiconductor
• DPRAM BANK_ID field is set to “00”.
This concludes the configuration of the ORSPI4 SPIA Core in the dynamic mode.
In LOW SPEED STATIC mode (bit 2 of register 30915 selected) and in LOW SPEED QUARTER RATE STATIC
mode (bit 0 of register 30915 selected), the baseline procedure and the training procedure is not required. This
means that the High Speed PLL is bypassed and therefore the BIT 0 of register 30910 will always be high. In static
mode this is normal and should be ignored. In fact the only relevant bits in register 30910 are bits 6 and 7. If these
bits are not high then that means ORSPI4 has hand-shaken with another device properly.
Delay-Taps in STATIC mode
After all the configuration procedure is performed, there is a possibility of ORSPI4 experiencing DIP-4 errors and
RX alignment status flag being high. This can be tackled using two FPGA/CORE interface signals called
SPI_DATM_A and SPI_DLYTAP_A [2:0]. With SPI_DATM_A set to high, SPI_DLYTAP_A[2:0] should be varied from
0 to 6 to adjust the RX data with respect to RDCLK to get a valid data eye. This would help getting rid of the DIP4
errors and the RX alignment status flag. This procedure is also a function of how the Board designer has laid out
the 16 RX_DATA lanes. If all the lengths are grossly mismatched then this mechanism may not work, so it is imper-
ative to design the board keeping the lengths of the RX_DATA as close as possible.
SERDES Start-Up Sequence
The following sequence is required by the SERDES. For information required for simulation that may be different
than this sequence, see the ORSPI4 Design Kit.
1. Initiate a hardware reset by making RESETN low. Keep this low during FPGA configuration of the device. The
2. Configure the following SERDES internal and external registers. Note that after device initialization, all alarm
• Bits LCKREFN_[A:D] to “1”, which implies lock to data.
• Bits ENBYSYNC_[A:D] to “1” which enables dynamic alignment to comma.
Set the following bits in register 30801:
• Bits LOOPENB_[A:D] to “1” if high-speed serial loopback is desired.
Set the following bits in registers 30002, 30012, 30022, 30032:
• TXHR set to “1” if TX half-rate is desired.
SPIA_TXk_PORT_ID (k=32, 64, 128) signal. If M bit is not set then the port ID programmed in the TX calendar
will be broadcast to the FPGA.
– Address location 31003 is not used.
– Write 01 HEX to 31004 corresponding to port 1.
– Write 0F HEX to 31005 (000 to partition ID field and 1111 to BURST_VAL field).
– Write 0D HEX to 31006 (MB_EN bit is set to ‘1’, M bit is set to ‘1’ and DPRAM BANK_ID field is set to “01”).
– Address location 31007 is not used.
– Write 02 HEX to 31008 corresponding to port 2.
– Write 0F HEX to 31009 (000 to partition ID field and 1111 to BURST_VAL field).
– Write 0E HEX to 3100A (MB_EN bit is set to ‘1’, M bit is set to ‘1’ and DPRAM BANK_ID field is set to “10”).
– Address location 3100B is not used.
– Write 03 HEX to 3100C corresponding to port 3.
– Write 0F HEX to 3100D (000 to partition ID field and 1111 to BURST_VAL field).
– Write 0F HEX to 3100E (MB_EN bit is set to ‘1’, M bit is set to ‘1’ and DPRAM BANK_ID field is set to “10”).
– Address location 3100F is not used.
device will be ready for operation 3 ms after the low to high transition of RESETN.
and status bits should be read once to clear them. A subsequent read will provide the valid state. Set the fol-
lowing bits in register 30800:
151
ORCA ORSPI4 Data Sheet

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